公开(公告)号：US20130082368A1

公开(公告)日：2013-04-04

申请号：US13632215

申请日：2012-10-01

申请人： Samsung Electronics Co., Ltd.

发明人： Tae-hoon KIM ,  Young-lyong KIM ,  Hyeong-seob KIM ,  Kil-soo KIM

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： An EMI shielded semiconductor package includes a semiconductor package and an EMI shield layer formed on at least a part of a surface of the EMI shielded semiconductor package. The EMI shield layer includes a matrix layer; a metal layer positioned on the matrix layer; and a first seed particle positioned in an interface between the matrix layer and the metal layer. Unlike a conventional shielding process that is performed for a device level, a shielding process may be performed for a mounting substrate level, and thus the semiconductor package and the substrate module may be manufactured with high-productivity at low costs in a short period of time.

摘要翻译： EMI屏蔽半导体封装包括形成在EMI屏蔽半导体封装的表面的至少一部分上的半导体封装和EMI屏蔽层。 EMI屏蔽层包括矩阵层; 位于基体层上的金属层; 以及位于基质层和金属层之间的界面中的第一种子颗粒。 与针对器件级别执行的常规屏蔽处理不同，可以对安装衬底级别执行屏蔽工艺，因此半导体封装和衬底模块可以在短时间内以低成本生产高生产率 。