公开(公告)号：US20130256917A1

公开(公告)日：2013-10-03

申请号：US13792942

申请日：2013-03-11

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Young-lyong KIM ,  Seong-ho SHIN ,  Jae-gwon JANG ,  Jong-ho LEE

IPC分类号： H01L23/00

CPC分类号： H01L24/46 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45664 ,  H01L2924/00012

摘要： A semiconductor package includes a master chip and a slave chip stacked on a substrate. The master chip and the slave chip are connected to one another by a bonding wire. The master chip and the slave chip are connected in series with an external circuit. The semiconductor package may have a low loading factor and excellent performance, and may be mass produced at low costs.

摘要翻译： 半导体封装包括堆叠在基板上的主芯片和从芯片。 主芯片和从芯片通过接合线彼此连接。 主芯片和从芯片与外部电路串联连接。 半导体封装可以具有低负载率和优异的性能，并且可以以低成本批量生产。

公开(公告)号：US20140103523A1

公开(公告)日：2014-04-17

申请号：US14045881

申请日：2013-10-04

申请人： Samsung Electronics Co., Ltd.

发明人： Jae-gwon JANG ,  Young-lyong KIM ,  Jin-woo PARK ,  Ae-nee JANG

IPC分类号： H01L23/498

CPC分类号： H01L23/49838 ,  H01L23/49811 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/81193 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/15311

摘要： A semiconductor package including a lower semiconductor chip, and an upper semiconductor chip flip-chip bonded on the lower semiconductor chip may be provided. Each of the lower and upper semiconductor chips includes a first bonding pad formed on an active surface, which has a center line extending in a first direction, and a first rewire electrically connected to the first bonding pad, The first rewire includes first and second connection regions. The first and second connection regions face each other and are disposed at a same distance from the center line in a second direction, which is perpendicular to the first direction.

摘要翻译： 可以提供包括下半导体芯片的半导体封装和结合在下半导体芯片上的上半导体芯片倒装芯片。 下半导体芯片和上半导体芯片中的每一个包括形成在有源表面上的第一焊盘，该焊盘具有沿第一方向延伸的中心线，以及电连接到第一焊盘的第一重新布线。第一布线包括第一和第二连接 地区。 第一连接区域和第二连接区域彼此面对，并且在与第一方向垂直的第二方向上以与中心线相同的距离设置。

公开(公告)号：US20190237410A1

公开(公告)日：2019-08-01

申请号：US16381319

申请日：2019-04-11

申请人： Samsung Electronics Co., Ltd.

发明人： Young-lyong KIM ,  Hyun-soo Chung ,  Dong-hyeon Jang

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L23/34 ,  H01L23/538 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L23/552 ,  H01L23/345 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/5384 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/0635

摘要： A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.

公开(公告)号：US20130082368A1

公开(公告)日：2013-04-04

申请号：US13632215

申请日：2012-10-01

申请人： Samsung Electronics Co., Ltd.

发明人： Tae-hoon KIM ,  Young-lyong KIM ,  Hyeong-seob KIM ,  Kil-soo KIM

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2224/0401

摘要： An EMI shielded semiconductor package includes a semiconductor package and an EMI shield layer formed on at least a part of a surface of the EMI shielded semiconductor package. The EMI shield layer includes a matrix layer; a metal layer positioned on the matrix layer; and a first seed particle positioned in an interface between the matrix layer and the metal layer. Unlike a conventional shielding process that is performed for a device level, a shielding process may be performed for a mounting substrate level, and thus the semiconductor package and the substrate module may be manufactured with high-productivity at low costs in a short period of time.

摘要翻译： EMI屏蔽半导体封装包括形成在EMI屏蔽半导体封装的表面的至少一部分上的半导体封装和EMI屏蔽层。 EMI屏蔽层包括矩阵层; 位于基体层上的金属层; 以及位于基质层和金属层之间的界面中的第一种子颗粒。 与针对器件级别执行的常规屏蔽处理不同，可以对安装衬底级别执行屏蔽工艺，因此半导体封装和衬底模块可以在短时间内以低成本生产高生产率 。