公开(公告)号：US09355947B2

公开(公告)日：2016-05-31

申请号：US14698826

申请日：2015-04-28

申请人： Samsung Electronics Co., Ltd.

发明人： Hyo-soon Kang ,  Sun-won Kang ,  Joon-young Park ,  Doo-hee Hwang ,  Tae-young Yoon

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A printed circuit board (PCB) includes a base substrate including upper and lower surfaces, a plurality of solder ball pads separately formed on the lower surface of the base substrate in a radial direction and forming one or more radial pad groups, a plurality of first traces respectively connected to the plurality of solder ball pads and extending to an inside of the radial pad group, and a plurality of second traces respectively connected to the plurality of first traces and extending to an outside of the radial pad group.

摘要翻译： 印刷电路板（PCB）包括：基底基板，包括上表面和下表面;多个焊球焊盘，其分别形成在基底基板的下表面上并沿径向形成一个或多个径向焊盘组;多个第一 分别连接到多个焊球焊盘并延伸到径向焊盘组的内部的迹线以及分别连接到多个第一迹线并延伸到径向焊盘组的外部的多个第二迹线。