SUBSTRATE DEBONDING APPARATUS
    2.
    发明申请

    公开(公告)号:US20230052565A1

    公开(公告)日:2023-02-16

    申请号:US17718635

    申请日:2022-04-12

    Abstract: A substrate debonding apparatus includes a chuck attached to a second surface opposite to the first surface of the semiconductor substrate via a second adhesive layer. The chuck is configured to support a lower portion of a base film having a cross-sectional area in a horizontal direction greater than a cross-sectional area of the semiconductor substrate in the horizontal direction. The semiconductor debonding apparatus further includes a fixing ring arranged above the chuck and configured to fix in position an edge portion of the base film, and a cover ring arranged above the fixing ring and configured to adjust a diameter of an opening exposing the carrier substrate. The cover ring includes a guide frame arranged above the fixing ring, and a plurality of cover blades configured to move in a horizontal direction determined by the guide frame.

    BURIED TYPE AIR PURIFIER
    3.
    发明申请

    公开(公告)号:US20220349595A1

    公开(公告)日:2022-11-03

    申请号:US17867916

    申请日:2022-07-19

    Abstract: A buried type air purifier including a main body to be buried in a buried space through a buried opening provided on a boundary surface between a use space and the buried space, the main body having an intake passage and a discharge passage which take in and discharge air, respectively; a fan to guide air of the use space along the intake passage and the discharge passage; and a filter to filter the air. The main body includes: a first main body part having a fan accommodating part to accommodate the fan; and a second main body part having a cross sectional area, which is parallel with the boundary surface, being smaller than the first main body part, where the second main body part is formed to pass the intake and discharge passages through which the air guided via the fan accommodated in the fan accommodating part passes.

    FILTER ASSEMBLY AND AIR CONDITIONING APPARATUS HAVING THE SAME

    公开(公告)号:US20210187424A1

    公开(公告)日:2021-06-24

    申请号:US17130644

    申请日:2020-12-22

    Abstract: An air conditioning apparatus is disclosed. The air conditioning apparatus includes a filter, a fan configured to generate an air flow, a case configured to accommodate the filter and the fan within, and including a support member supporting the filter, and a sealing member covering a gap between the case and the filter, and the filter includes a side-surface member formed along a side-surface, and at least one from among the support member and the side-surface member is formed with a groove which transfers pressure of an upstream side of the filter to the sealing member based on the fan operating.

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