INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD USING THE SAME
    3.
    发明申请
    INDUCTIVELY COUPLED PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD USING THE SAME 审中-公开
    电感耦合等离子体加工设备和等离子体处理方法

    公开(公告)号:US20140273484A1

    公开(公告)日:2014-09-18

    申请号:US14200978

    申请日:2014-03-07

    Abstract: An inductively coupled plasma processing apparatus includes a chamber configured to provide a space for processing a substrate and including a window formed in an upper portion thereof, a substrate stage configured to support the substrate within the chamber and including a lower electrode, the lower electrode configured to receive a first radio frequency signal, an upper electrode arranged on the upper portion of the chamber with the window interposed between the upper electrode and the space for processing the substrate, the upper electrode configured to receive a second radio frequency signal, a conductive shield member arranged within the chamber and configured to cover the window, and a shield power supply configured to apply a shield signal to the shield member in synchronization with the second radio frequency signal.

    Abstract translation: 电感耦合等离子体处理装置包括:腔室,其被构造成提供用于处理衬底的空间,并且包括在其上部形成的窗口;衬底台,被配置为将衬底支撑在腔室内并且包括下电极,所述下电极构造 接收第一射频信号,布置在所述室的上部的上电极,所述窗插入在所述上电极和用于处理所述衬底的空间之间,所述上电极被配置为接收第二射频信号,导电屏蔽 构件,其布置在室内并且构造成覆盖窗口;以及屏蔽电源,被配置为与第二射频信号同步地向屏蔽构件施加屏蔽信号。

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