公开(公告)号：US20180131087A1

公开(公告)日：2018-05-10

申请号：US15807094

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Young KIM ,  Sang-Seob KIM ,  Min PARK ,  Jung-Je BANG ,  Beom-Ju KIM ,  Jae-Heung YE ,  Yong-Won LEE ,  Jung-Sik PARK

IPC: H01Q1/52 ,  H01L23/552 ,  H05K1/18 ,  H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  G06F3/041 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q1/22

CPC classification number: H01Q1/526 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  H01L23/552 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H04M1/0266 ,  H04M1/0277 ,  H04M1/03 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/147 ,  H05K1/181 ,  H05K9/0024 ,  H05K9/0026 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.

公开(公告)号：US20170172020A1

公开(公告)日：2017-06-15

申请号：US15377012

申请日：2016-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Heung YE ,  Jung-Je BANG ,  Jeong-Ung KIM ,  Ki-Youn JANG

IPC: H05K9/00

CPC classification number: H05K9/0081 ,  H05K9/0024 ,  H05K9/0033 ,  H05K9/0084 ,  H05K2201/10371

Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure. According to an example embodiment, the electronic device may include: a housing that includes a first surface directed in a first direction and a second surface directed in a second direction that is opposite to the first direction; a printed circuit board included in the housing, wherein the printed circuit board includes a first surface directed in the first direction and a second surface directed in the second direction; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure configured to electro-magnetically shield the at least one electronic component, and the shield structure may include: a flexible sheet that includes a first sheet that covers the at least one electronic component and a second sheet that at least partially covers the space between the first sheet and the first surface of the printed circuit board, when viewed from above the first surface of the printed circuit board; and at least one frame structure that supports the first and second sheets.