公开(公告)号：US20180279516A1

公开(公告)日：2018-09-27

申请号：US15937646

申请日：2018-03-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Chang-Joon LEE ,  Yong-Won LEE ,  Hyun-Tae JANG

IPC: H05K9/00 ,  H05K3/30 ,  H05K1/05 ,  H05K1/03 ,  H05K1/18

Abstract: According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.

公开(公告)号：US20180131087A1

公开(公告)日：2018-05-10

申请号：US15807094

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-Young KIM ,  Sang-Seob KIM ,  Min PARK ,  Jung-Je BANG ,  Beom-Ju KIM ,  Jae-Heung YE ,  Yong-Won LEE ,  Jung-Sik PARK

IPC: H01Q1/52 ,  H01L23/552 ,  H05K1/18 ,  H05K9/00 ,  H05K1/11 ,  H05K1/14 ,  G06F3/041 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q1/22

CPC classification number: H01Q1/526 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/044 ,  H01L23/552 ,  H01Q1/2283 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H04M1/0266 ,  H04M1/0277 ,  H04M1/03 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/147 ,  H05K1/181 ,  H05K9/0024 ,  H05K9/0026 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.