INTEGRATED CIRCUIT DEVICES
    1.
    发明申请

    公开(公告)号:US20250120140A1

    公开(公告)日:2025-04-10

    申请号:US18743372

    申请日:2024-06-14

    Inventor: Jisoo Oh

    Abstract: An integrated circuit device includes a substrate; a fin-type active region that extends in a first horizontal direction on the substrate; a gate line on the fin-type active region, wherein the gate line extends in a second horizontal direction that intersects the first horizontal direction; and a gate dielectric film that is in contact with a lower surface and opposite sidewalls of the gate line, wherein a gate upper surface of the gate line includes a portion that has a decreasing distance from the substrate in a vertical direction as a distance between the portion of the gate upper surface of the gate line and the gate dielectric film in the first horizontal direction decreases.

    Methods of fabricating semiconductor devices

    公开(公告)号:US10186457B2

    公开(公告)日:2019-01-22

    申请号:US15794107

    申请日:2017-10-26

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

    Methods of fabricating semiconductor devices

    公开(公告)号:US10522401B2

    公开(公告)日:2019-12-31

    申请号:US16237948

    申请日:2019-01-02

    Abstract: A semiconductor device includes an active pattern, a gate electrode, a gate capping pattern, and a gate spacer. The active pattern extends in a first direction parallel to a top surface of the substrate. The gate electrode extends in a second direction parallel to the top surface of the substrate and intersects the active pattern. The gate capping pattern covers a top surface of the gate electrode and extends in a direction crossing the top surface of the substrate to cover a first sidewall of the gate electrode. The gate spacer covers a second sidewall of the gate electrode. The first sidewall and the second sidewall are opposite to each other in the second direction.

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