公开(公告)号：US20240014163A1

公开(公告)日：2024-01-11

申请号：US18312191

申请日：2023-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Youn KIM ,  Eung Kyu KIM ,  Min Jun BAE ,  Hyeon Seok LEE ,  Seok Kyu CHOI

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L24/16 ,  H01L24/08 ,  H01L24/73 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L25/162 ,  H01L2224/08235 ,  H01L24/48 ,  H01L2224/26175 ,  H01L2924/1205 ,  H01L2224/16168 ,  H01L2224/32155 ,  H01L2224/48228 ,  H01L2224/73204

Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side, a semiconductor chip on the first side of the redistribution substrate, a silicon capacitor on the second side of the redistribution substrate, a plurality of solder balls on the second side of the redistribution substrate and adjacent the silicon capacitor, and a metal pattern in the redistribution substrate and positioned between the silicon capacitor and the solder balls. The metal pattern includes a first portion extending in a first direction, and a second portion connected to the first portion and extending in a second direction different from the first direction.

公开(公告)号：US20220352050A1

公开(公告)日：2022-11-03

申请号：US17866866

申请日：2022-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Kyu KIM ,  Jung-Ho PARK ,  Jong Youn KIM ,  Yeon Ho JANG ,  Jae Gwon JANG

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L21/78 ,  H01L25/00 ,  H01L21/683

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.

公开(公告)号：US20210020608A1

公开(公告)日：2021-01-21

申请号：US16744623

申请日：2020-01-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Youn KIM ,  Dong Kyu Kim ,  Jin-Woo Park ,  Min Jun Bae ,  Gwang Jae Jeon

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/544 ,  H01L23/00

Abstract: A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.