利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.017 秒)

    ELECTRONIC DEVICE INCLUDING ANTENNA STRUCTURE
    1.
    发明申请
    ELECTRONIC DEVICE INCLUDING ANTENNA STRUCTURE 有权

    公开(公告)号：US20220085489A1

    公开(公告)日：2022-03-17

    申请号：US17518951

    申请日：2021-11-04

    申请人： Samsung Electronics Co., Ltd.

    发明人： In NAM ,  Youngkon LIM ,  Jongdoo KIM

    IPC分类号： H01Q1/24 ,  H01Q7/00 ,  H01Q1/52 ,  H01Q1/02 ,  H01Q1/38

    摘要： An electronic device is provided. The electronic device includes a housing, a substrate disposed in an internal space of the housing, a battery disposed on a plane identical with a plane of the substrate, a support structure disposed to at least partially overlap the substrate when the substrate is viewed from a top, an antenna structure configured to include a dielectric substrate and at least one coil member disposed in the dielectric substrate as an antenna disposed to at least partially overlap the battery when the battery is viewed from the top, a tape member configured to include a first region at least partially overlapping the support structure, a second region at least partially overlapping the antenna structure, and a connection part connecting the first region and the second region when the support structure is viewed from the top. The dielectric substrate may include at least one extension part extended from the dielectric substrate and configured to at least partially overlap the connection part when the antenna structure is viewed from the top. The at least one extension part may include a plurality of dummy patterns formed at designated intervals and/or in a designated shape.

    ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
    3.
    发明申请
    ANTENNA STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20230021496A1

    公开(公告)日：2023-01-26

    申请号：US17866101

    申请日：2022-07-15

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Taihwan CHOI ,  Dokyun KIM ,  Jongdoo KIM ,  Hyoseok NA ,  Kwangseok AHN ,  Wongi HWANG

    IPC分类号： H04M1/02 ,  H01Q1/24

    摘要： An electronic device according to various embodiments of the disclosure may include: a first housing including a first conductive portion, a first non-conductive portion, and a first segmented portion extending from the first conductive portion, a second housing configured to accommodate at least a portion of the first housing and to guide a slide movement of the first housing, the second housing including a second conductive portion, and a flexible display including a first area connected to the first housing and a second area extending from the first area and configured to be bendable or rollable, wherein, from a slide-in state to a slide-out state of the first housing with respect to the second housing, the first conductive portion and the second conductive portion may be spaced apart from each other, and in the slide-in state of the first housing with respect to the second housing, at least a portion of the first non-conductive portion may overlap the second conductive portion.

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    5.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220292245A1

    公开(公告)日：2022-09-15

    申请号：US17554517

    申请日：2021-12-17

    申请人： SAMSUNG ELECTRONICS CO., LTD.

    发明人： Akio MISAKA ,  Jongdoo KIM ,  Noyoung CHUNG

    IPC分类号： G06F30/392 ,  G06F30/398 ,  H01L27/02 ,  G03F7/20

    摘要： A method of manufacturing a semiconductor device is disclosed. The method includes generating a first virtual layout by placing and routing standard cells using a virtual netlist, searching first duplicate pattern regions in the first virtual layout and choosing one of them as a first representative pattern region, performing an OPC operation on the first representative pattern region to obtain a first OPC result, generating an actual layout by placing and routing standard cells using an actual netlist, performing an OPC operation on the actual layout, and forming a photoresist pattern on a substrate using a photomask manufactured based on the actual layout, to which the OPC operation is applied.

    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD PLACED ADJACENT TO FRAME MADE OF CONDUCTIVE MATERIAL
    8.
    发明申请
    ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD PLACED ADJACENT TO FRAME MADE OF CONDUCTIVE MATERIAL 有权

    公开(公告)号：US20220311845A1

    公开(公告)日：2022-09-29

    申请号：US17673216

    申请日：2022-02-16

    申请人： Samsung Electronics Co., Ltd.

    发明人： Sanguk KIM ,  Jongdoo KIM ,  Hyoseok NA ,  Daeseung PARK ,  Wanjae JU

    IPC分类号： H04M1/02

    摘要： An electronic device is provided. The electronic device includes a first mechanical element, a second mechanical element moving with respect to the first mechanical element, a frame including a first frame formed of a conductive material and coupled to the first mechanical element and a second frame formed of a conductive material and coupled to the second mechanical element, a segmentation part formed at the frame to segment each of the first frame and the second frame into a plurality of parts, and a first substrate member which includes a first part and a second part spaced apart from each other, and a first bending part for bendably connecting the first part and the second part and is disposed to move together with at least one of the first mechanical element and the second mechanical element, wherein a plurality of wires arranged at the first substrate member may be arranged not to pass through a first area which is an area of the first bending part of the first substrate member and is adjacent to the segmentation part.