公开(公告)号：US20240079366A1

公开(公告)日：2024-03-07

申请号：US18454217

申请日：2023-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggyu Lee ,  Jaechoon Kim ,  Taehwan Kim ,  Hwanjoo Park

IPC: H01L23/00 ,  H01L23/36 ,  H01L25/065

CPC classification number: H01L24/33 ,  H01L23/36 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33505 ,  H01L2224/33519 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/065 ,  H01L2924/16235 ,  H01L2924/1631 ,  H01L2924/1632 ,  H01L2924/165

Abstract: A semiconductor package includes a package substrate, a semiconductor chip on the package substrate and having a first surface facing the package substrate and a second surface, opposite to the first surface, an encapsulant disposed on the package substrate and on a side surface of the semiconductor chip, a heat dissipation member on the semiconductor chip and spaced apart from the semiconductor chip, a bonding enhancing layer on the second surface of the semiconductor chip, a thermal interface material layer on the bonding enhancing layer and in a gap between the bonding enhancing layer and the heat dissipation member, wherein the thermal interface material layer includes liquid metal, and a porous barrier structure formed of a metal material and surrounding the bonding enhancing layer and the thermal interface material layer.

公开(公告)号：US20240055339A1

公开(公告)日：2024-02-15

申请号：US18229039

申请日：2023-08-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwanjoo Park ,  Sunggu Kang ,  Jaechoon Kim ,  Taehwan Kim ,  Sungho Mun ,  Jonggyu Lee

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/367 ,  H01L25/065

CPC classification number: H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L23/49816 ,  H01L23/3675 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/16145 ,  H01L2224/32146 ,  H01L2224/32235 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2924/1435 ,  H01L2924/1431 ,  H01L2924/182

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor package on the first redistribution structure, the first semiconductor package including a first semiconductor chip which includes a first device layer and a first semiconductor substrate including a through electrode, a second semiconductor chip which is on the first semiconductor chip and includes a second device layer and a second semiconductor substrate, and a molding member surrounding the first semiconductor chip, a second redistribution structure on an upper surface of the molding member, and a second semiconductor package on the second redistribution structure, the second semiconductor package including a third semiconductor chip, wherein the second semiconductor chip is apart from the second semiconductor package in a horizontal direction, and an upper surface of the second semiconductor chip is higher than the upper surface of the molding member.

公开(公告)号：US20250099029A1

公开(公告)日：2025-03-27

申请号：US18887842

申请日：2024-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chanwon Lee ,  Doyoon Kim ,  Jonggyu Lee

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/11 ,  A61B5/1455 ,  A61B5/28

Abstract: Provided is a sleep management system, including a plurality of sensors including a first sensor and a second sensor being configured to collect data of a user, a hub device configured to receive first data collected by the first sensor and second data collected by the second sensor, obtain first processed data based on processing of the first data and second processed data based on processing of the second data, and a user device configured to receive the first processed data and the second processed data, obtain sleep state information corresponding to a sleep stage and a body movement of the user based on the first processed data and the second processed data, determine whether a non-rapid eye movement (NREM) sleep behavior disorder of the user occurs based on the user's sleep stage and the user's body movement, and perform a preset operation based on an occurrence of the NREM.

公开(公告)号：US20240170366A1

公开(公告)日：2024-05-23

申请号：US18512640

申请日：2023-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggyu Lee ,  Youngsuk Nam ,  Seokkan Ki ,  Jaechoon Kim ,  Taehwan Kim

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/4275 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/065 ,  H01L2924/1611 ,  H01L2924/186 ,  H01L2924/20102

Abstract: Provided is a semiconductor package including a circuit board, a semiconductor chip on the circuit board, a heat dissipation member adjacent to the semiconductor chip, and a heat transmission member between the semiconductor chip and the heat dissipation member, the heat transmission member including a resin insulating body and phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member.

公开(公告)号：US20240321682A1

公开(公告)日：2024-09-26

申请号：US18394575

申请日：2023-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonggyu Lee ,  Jaechoon Kim ,  Youngjoon Koh ,  Taehwan Kim

IPC: H01L23/427 ,  H01L23/00 ,  H01L23/528 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/473 ,  H01L23/3677 ,  H01L23/3733 ,  H01L23/44 ,  H01L24/32 ,  H01L25/18 ,  H10B80/00 ,  H01L24/16 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1431

Abstract: Provided is a semiconductor package including a package substrate, a semiconductor device mounted on the package substrate, and a heat dissipation structure attached onto the semiconductor device, wherein the heat dissipation structure includes a plurality of vapor chambers at different levels in the vertical direction and a plurality of heat pipes extending between the plurality of vapor chambers.

公开(公告)号：US11315458B2

公开(公告)日：2022-04-26

申请号：US17074109

申请日：2020-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoseong Seo ,  Battushig Ganbold ,  Seungik Kim ,  Taehyoung Kim ,  Hojin Byun ,  Cheolwu Oh ,  Kwansoo Lee ,  Jonggyu Lee ,  Jaewook Han ,  Minhyeong Hong

IPC: G09G3/06 ,  G06F3/16 ,  G09G5/02

Abstract: A display apparatus includes a display, a plurality of light sources provided to the display, a receiver, and a processor. The processor is configured to, based on an audio signal having a plurality of channels being received from the receiver, obtain a plurality of audio signals corresponding to the plurality of channels from the audio signal, respectively, identify a plurality of colors for the plurality of audio signals, respectively, based on a frequency component of the plurality of audio signals, respectively, among a plurality of frequency components, and control the plurality of light sources to emit light with the plurality of colors, respectively, based on mapping of the plurality of light sources to the plurality of channels.