公开(公告)号：US12021046B2

公开(公告)日：2024-06-25

申请号：US17944983

申请日：2022-09-14

申请人： STMICROELECTRONICS S.r.l.

发明人： Paolo Colpani ,  Samuele Sciarrillo ,  Ivan Venegoni ,  Francesco Maria Pipia ,  Simone Bossi ,  Carmela Cupeta

IPC分类号： H01L23/00 ,  H01L21/02 ,  H01L21/768 ,  H01L23/528

CPC分类号： H01L24/03 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/528 ,  H01L24/05 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/03464 ,  H01L2224/03614 ,  H01L2224/04042 ,  H01L2224/05024 ,  H01L2224/05083 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05664 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0132 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107

摘要： A method of manufacturing a redistribution layer includes: forming an insulating layer on a wafer, delimited by a top surface and a bottom surface in contact with the wafer; forming a conductive body above the top surface of the insulating layer; forming a first coating region extending around and above the conductive body, in contact with the conductive body, and in contact with the top surface of the insulating layer in correspondence of a bottom surface of the first coating region; applying a thermal treatment to the wafer in order to modify a residual stress of the first coating region, forming a gap between the bottom surface of the first coating region and the top surface of the insulating layer; forming, after applying the thermal treatment, a second coating region extending around and above the first coating region, filling said gap and completely sealing the first coating region.

公开(公告)号：US20180047655A1

公开(公告)日：2018-02-15

申请号：US15791815

申请日：2017-10-24

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Isabel DE SOUSA ,  Annique LAVOIE ,  Eric SALVAS ,  Michel TURGEON

IPC分类号： H01L23/367 ,  H01L21/321 ,  H01L21/324 ,  H01L21/48 ,  H01L21/50 ,  H01L21/52 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L23/00 ,  H01L21/3105 ,  H01L25/00 ,  H01L23/373 ,  H01L23/50

CPC分类号： H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US09831199B2

公开(公告)日：2017-11-28

申请号：US15275522

申请日：2016-09-26

申请人： FUJITSU LIMITED

发明人： Taiki Uemura ,  Seiki Sakuyama

IPC分类号： H01L23/52 ,  H01L23/00

CPC分类号： H01L24/05 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05639 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29199 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/014

摘要： An electronic device includes a first electronic part, a second electronic part opposite the first electronic part, and a bonding portion between the first electronic part and the second electronic part. The bonding portion contains a solder containing a substance whose crystal structure reversibly changes in temperature rise and fall processes which accompany the operation of the electronic device or electronic equipment including the electronic device. A change in the crystal structure of the substance contained in the solder promotes recovery and recrystallization of the solder in the temperature rise and fall processes which accompany the operation of the electronic device or the electronic equipment. As a result, the coarsening of crystal grains in the solder is suppressed.

公开(公告)号：US09761505B2

公开(公告)日：2017-09-12

申请号：US14921067

申请日：2015-10-23

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Isabel De Sousa ,  Annique Lavoie ,  Eric Salvas ,  Michel Turgeon

IPC分类号： H01L21/48 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56 ,  H01L21/66 ,  H01L23/04 ,  H01L23/42 ,  H01L21/50 ,  H01L25/00 ,  H01L21/3105 ,  H01L21/52 ,  H01L21/321 ,  H01L21/324 ,  H01L23/373 ,  H01L23/50

CPC分类号： H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

公开(公告)号：US20170248590A1

公开(公告)日：2017-08-31

申请号：US15097899

申请日：2016-04-13

申请人： National Tsing Hua University

发明人： Yu-Lin Wang ,  Chen-Pin Hsu ,  Pei-Chi Chen

IPC分类号： G01N33/543 ,  H01L23/00 ,  H01L23/29 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

CPC分类号： H01L24/32 ,  G01D11/245 ,  H01L21/4846 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/32225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/0496 ,  H01L2924/0509 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/10344 ,  H01L2924/1082 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/1306 ,  H01L2924/13061 ,  H01L2924/13064 ,  H01L2924/146 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106

摘要： Provided is a manufacturing method of a sensor including the following steps. A mold having a cavity is provided. At least one chip is disposed in the cavity. The chip has an active surface and a back surface opposite to each other. The active surface faces toward a bottom surface of the cavity. A polymer material is filled in the cavity to cover the back surface of the chip. A heat treatment is performed, such that the polymer material is solidified to form a polymer substrate. A mold release treatment is performed to isolate the polymer substrate from the cavity. A plurality of conductive lines are formed on a first surface of the polymer substrate. The conductive lines are electrically connected with the chip.

公开(公告)号：US20170186627A1

公开(公告)日：2017-06-29

申请号：US15456767

申请日：2017-03-13

申请人： Kulicke and Soffa Industries, Inc.

发明人： Robert N. Chylak ,  Dominick A. DeAngelis ,  Horst Clauberg

IPC分类号： H01L21/449 ,  H01L21/762 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L21/449 ,  H01L21/76251 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/75 ,  H01L24/81 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2021/60195 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/136 ,  H01L2224/13687 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75343 ,  H01L2224/75348 ,  H01L2224/75349 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81355 ,  H01L2224/81409 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/81906 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20301 ,  H01L2924/20302 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/8121 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/81 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0503 ,  H01L2924/01013 ,  H01L2924/0504 ,  H01L2924/0105 ,  H01L2924/0502 ,  H01L2924/0103 ,  H01L2924/0494 ,  H01L2924/0104 ,  H01L2924/0495 ,  H01L2924/01023 ,  H01L2924/0496 ,  H01L2924/01024 ,  H01L2924/05 ,  H01L2924/01028 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0542 ,  H01L2924/0534 ,  H01L2924/0535 ,  H01L2924/0536 ,  H01L2924/054 ,  H01L2924/0463 ,  H01L2924/0464 ,  H01L2924/0462 ,  H01L2924/0454 ,  H01L2924/0455 ,  H01L2924/0456 ,  H01L2924/046 ,  H01L2924/01105

摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.

公开(公告)号：US09691677B2

公开(公告)日：2017-06-27

申请号：US14423821

申请日：2014-09-10

申请人： DEXERIALS CORPORATION

发明人： Taichi Koyama

IPC分类号： H01L23/29 ,  H01L21/56 ,  C08J5/18 ,  C09J133/04 ,  C09J163/08 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L23/293 ,  C08G59/4284 ,  C08J5/18 ,  C08J2333/16 ,  C08J2363/02 ,  C08J2433/16 ,  C08J2463/02 ,  C08L63/00 ,  C09J133/04 ,  C09J163/08 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/83191 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/186 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/00 ,  H01L2224/81805 ,  C08L33/00

摘要： An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material, including an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, the minimum melt viscosity being between 1000 Pa*s and 2000 Pa*s, and gradient of melt viscosity between 10° C. higher than the minimum melt viscosity attainment temperature and a temperature 10° C. higher being between 900 Pa*s/° C. and 3100 Pa*s/° C., is applied to a semiconductor chip having a solder-tipped electrode formed thereon, and the semiconductor chip is mounted onto a circuit substrate having a counter electrode opposing the solder-tipped electrode, and the semiconductor chip and the circuit substrate are thermocompressed under bonding conditions of raising the temperature from a first temperature to a second temperature at a predetermined rate.

公开(公告)号：US09673167B2

公开(公告)日：2017-06-06

申请号：US14416297

申请日：2012-07-26

申请人： Markus Wimplinger

发明人： Markus Wimplinger

IPC分类号： H01L23/00 ,  H01L31/18 ,  B32B37/24 ,  B32B38/00 ,  C23C14/08 ,  C23C16/40

CPC分类号： H01L24/83 ,  B32B37/24 ,  B32B38/0008 ,  B32B2037/243 ,  B32B2037/246 ,  B32B2457/14 ,  C23C14/08 ,  C23C14/081 ,  C23C14/086 ,  C23C16/40 ,  C23C16/403 ,  C23C16/407 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L31/18 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/278 ,  H01L2224/27848 ,  H01L2224/2908 ,  H01L2224/29187 ,  H01L2224/29287 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32501 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/83001 ,  H01L2224/83002 ,  H01L2224/83011 ,  H01L2224/83012 ,  H01L2224/83013 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/8322 ,  H01L2224/8383 ,  H01L2224/83896 ,  H01L2224/83907 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/053 ,  H01L2924/12042 ,  H01L2924/20102 ,  H01L2924/0549 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0531 ,  H01L2924/01001 ,  H01L2924/01008 ,  H01L2924/00

摘要： This invention relates to a method for bonding of a first contact area of a first at least largely transparent substrate to a second contact area of a second at least largely transparent substrate, on at least one of the contact areas an oxide being used for bonding, from which an at least largely transparent interconnection layer is formed with an electrical conductivity of at least 10e1 S/cm2 (measurement: four point method, relative to temperature of 300K) and an optical transmittance greater than 0.8 (for a wavelength range from 400 nm to 1500 nm) on the first and second contact area.

公开(公告)号：US09397063B2

公开(公告)日：2016-07-19

申请号：US14707465

申请日：2015-05-08

申请人： Tessera, Inc.

发明人： Belgacem Haba

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L21/50 ,  H01L23/52 ,  B82Y40/00

CPC分类号： H01L24/17 ,  B82Y40/00 ,  H01L21/4853 ,  H01L21/50 ,  H01L23/49811 ,  H01L23/52 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/116 ,  H01L2224/1182 ,  H01L2224/11821 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13794 ,  H01L2224/13911 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16057 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/81026 ,  H01L2224/81099 ,  H01L2224/81143 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  Y10S977/773 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second component with the metallic nanoparticles disposed therebetween, and elevating a temperature at least at interfaces of the juxtaposed conductive elements to a joining temperature at which the metallic nanoparticles cause metallurgical joints to form between the juxtaposed conductive elements. The conductive elements of either of or both of the first component and the second component can include substantially rigid posts having top surfaces projecting a height above the surface of the respective component and edge surfaces extending at substantial angles away from the top surfaces thereof.

公开(公告)号：US20160043016A1

公开(公告)日：2016-02-11

申请号：US14921067

申请日：2015-10-23

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Isabel DE SOUSA ,  Annique LAVOIE ,  Eric SALVAS ,  Michel TURGEON

IPC分类号： H01L23/367 ,  H01L23/00

CPC分类号： H01L23/3675 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/324 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4882 ,  H01L21/50 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L22/10 ,  H01L22/12 ,  H01L22/20 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/50 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83048 ,  H01L2224/83191 ,  H01L2224/832 ,  H01L2224/83201 ,  H01L2224/838 ,  H01L2224/83855 ,  H01L2224/83908 ,  H01L2224/83986 ,  H01L2924/06 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/20102 ,  H01L2924/00 ,  H01L2924/00014

摘要： A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.