公开(公告)号：US10411338B2

公开(公告)日：2019-09-10

申请号：US15435715

申请日：2017-02-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chae Up Yoo ,  Ho Jung Nam ,  Min Cheol Seo ,  Sung Koo Park ,  Jung Ho Park

IPC: H01Q1/38 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q21/06

Abstract: An electronic device includes a carrier having a surface, a first antenna radiator configured to transmit and/or receive a signal of a specific frequency band, a second antenna radiator configured to transmit and/or receive a signal of the specific frequency band, a communication circuit electrically connected to the first antenna radiator and the second antenna radiator, and a processor configured to control the communication circuit. The first antenna radiator includes a first conductive pattern disposed at a portion of the surface of the carrier. The second antenna radiator includes a second conductive pattern disposed at another portion of the surface of the carrier. The first antenna radiator includes a first open stub extending from one point of the first conductive pattern and configured to provide a transmission coefficient between the first antenna radiator and the second antenna radiator that is lower than a specific value at the specific frequency band.

公开(公告)号：US11177205B2

公开(公告)日：2021-11-16

申请号：US16454304

申请日：2019-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Ho Park ,  Jong Youn Kim ,  Min Jun Bae

IPC: H01L23/49 ,  H01L23/31 ,  H01L23/36 ,  H01L23/538 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/42

Abstract: A semiconductor package includes a redistribution substrate having first and second surfaces opposed to each other, and including an insulation member, a plurality of redistribution layers on different levels in the insulation member, and a redistribution via having a shape narrowing from the second surface toward the first surface in a first direction; a plurality of UBM layers, each including a UBM pad on the first surface of the redistribution substrate, and a UBM via having a shape narrowing in a second direction, opposite to the first direction; and at least one semiconductor chip on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to the redistribution layer adjacent to the second surface among the plurality of redistribution layers.

公开(公告)号：US11967549B2

公开(公告)日：2024-04-23

申请号：US17509046

申请日：2021-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Ho Park ,  Jong Youn Kim ,  Min Jun Bae

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/42

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/08 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/42 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/02371 ,  H01L2224/024 ,  H01L2224/08235

Abstract: A semiconductor package includes a redistribution substrate having first and second surfaces opposed to each other, and including an insulation member, a plurality of redistribution layers on different levels in the insulation member, and a redistribution via having a shape narrowing from the second surface toward the first surface in a first direction; a plurality of UBM layers, each including a UBM pad on the first surface of the redistribution substrate, and a UBM via having a shape narrowing in a second direction, opposite to the first direction; and at least one semiconductor chip on the second surface of the redistribution substrate, and having a plurality of contact pads electrically connected to the redistribution layer adjacent to the second surface among the plurality of redistribution layers.

公开(公告)号：US11166368B2

公开(公告)日：2021-11-02

申请号：US16787712

申请日：2020-02-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Ho Park ,  In Won O ,  Hak Jun Kim

IPC: H01L23/498 ,  H01L25/065 ,  H05K1/02 ,  H05K1/11

Abstract: A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.

公开(公告)号：US10447908B2

公开(公告)日：2019-10-15

申请号：US15785868

申请日：2017-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Won Lee ,  Jung Ho Park ,  Chong Sam Chung

IPC: H04N5/225 ,  H04N5/232 ,  H04N13/239

Abstract: An electronic device includes a first camera for shooting in a first direction, a second camera for shooting in the first direction, and at least one processor for processing images collected through the first camera and the second camera. A specified spacing distance is maintained between the first camera and the second camera. Within a shortest focusable distance of the first camera, a first capture area of the first camera is included in a second capture area of the second camera or makes contact with an inside of the second capture area of the second camera.