公开(公告)号：US20210200477A1

公开(公告)日：2021-07-01

申请号：US17136818

申请日：2020-12-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin SEO ,  Byeonghui KIM ,  Kibeen JUNG ,  Seungjun YANG

IPC: G06F3/06 ,  G06N20/00

Abstract: A storage device is configured to manage a plurality of nonvolatile memories with a plurality of physical streams. An operation method of the storage device includes receiving an input/output request from an external host device, determining a 0-th virtual stream identifier, extracting a 0-th representative value from a 0-th virtual stream feature, extracting a first and second representative values corresponding to first and second physical streams , calculating distance information including first and second similarities between the 0-th virtual stream and each of the first and second physical streams, based on the extracted representative values, assigning one of the plurality of physical streams to the 0-th virtual stream, based on the distance information, and performing an operation corresponding to the input/output request, at the assigned physical stream, and the extracting and the calculating are performed by using machine learning model.

公开(公告)号：US20240055395A1

公开(公告)日：2024-02-15

申请号：US18206201

申请日：2023-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Manho LEE ,  Jungmin SEO ,  Kwangseob SHIN ,  Woosin CHOI ,  Junghwan CHOI

IPC: H01L25/065 ,  H01L23/00 ,  H10B80/00

CPC classification number: H01L25/0652 ,  H01L24/49 ,  H10B80/00 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2224/49052 ,  H01L2224/49096

Abstract: A buffer chip is wire-bonded to memory dies. A semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set of semiconductor dies, and the buffer chip. The second set of semiconductor dies are on the first set of semiconductor dies. The buffer chip includes a first set of die bond pads being close to the semiconductor die stack, and a second set of die bond pads being distant from the semiconductor die stack. The second set of wire bonds extends to the first set of die bond pads of the buffer chip, and the first set of wire bonds extends to the second set of die bond pads of the buffer chip.

公开(公告)号：US20240118836A1

公开(公告)日：2024-04-11

申请号：US18375456

申请日：2023-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Oscar P. PINTO ,  William MARTIN ,  Chansoo KIM ,  Jungmin SEO ,  Jangwook PARK

IPC: G06F3/06

CPC classification number: G06F3/0659 ,  G06F3/0626 ,  G06F3/0679

Abstract: Provided are systems, methods, and apparatuses for transferring programs from a host to a computational storage device is described. The method can include: determining a program to transfer from a host to a computational storage device, determining that a size of the program exceeds a predetermined threshold, and transferring, based on the size, at least a portion of the program to the computational storage device.

公开(公告)号：US20240212726A1

公开(公告)日：2024-06-27

申请号：US18544550

申请日：2023-12-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungmin SEO ,  Cheonan LEE ,  Sukkang SUNG

IPC: G11C7/10

CPC classification number: G11C7/1048

Abstract: A device includes an input/output circuit, wherein the input/output circuit includes: a control circuit configured to receive a signal indicating whether the device is activated; a variable voltage source configured to generate a variable voltage according to a control operation of the control circuit based on the signal received by the control circuit; an output driver including a first transistor and a second transistor; and a pad configured to output a current that is generated by the output driver, and wherein the variable voltage source is configured to provide the variable voltage to a body of the first transistor and a body of the second transistor.

公开(公告)号：US20210200454A1

公开(公告)日：2021-07-01

申请号：US17038371

申请日：2020-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeonghui KIM ,  Jungmin SEO ,  Kangho ROH ,  Hyeongyu MIN ,  Jooyoung HWANG

IPC: G06F3/06 ,  G06N20/00

Abstract: A method includes sampling input/output requests from a host to generate sampled input/output requests; classifying the sampled input/output requests into clusters using an unsupervised learning algorithm; determining a hot data range based on a characteristic of the clusters; and incorporating the determined hot data range into a hot data table.