公开(公告)号：US09768141B2

公开(公告)日：2017-09-19

申请号：US14632657

申请日：2015-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeYong Park ,  Junyoung Ko ,  Whasu Sin ,  Kyhyun Jung

IPC: B23K1/018 ,  H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  H05K13/04 ,  B23K26/38 ,  B23K101/42

CPC classification number: H01L24/799 ,  B23K1/0016 ,  B23K1/0056 ,  B23K1/018 ,  B23K26/38 ,  B23K2101/42 ,  H01L24/98 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K13/0486 ,  Y10T29/49821 ,  Y10T29/53274

Abstract: An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.