SEMICONDUCTOR DEVICE
    1.
    发明申请

    公开(公告)号:US20240405113A1

    公开(公告)日:2024-12-05

    申请号:US18537916

    申请日:2023-12-13

    Abstract: A semiconductor device includes a substrate. An active pattern extends in a first horizontal direction on the substrate. First to third nanosheets are sequentially spaced apart from each other in a vertical direction on the active pattern. A gate electrode extends in a second horizontal direction on the active pattern and surrounds the first to third nanosheets. A source/drain region includes a first layer disposed along side walls and a bottom surface of a source/drain trench and a second layer filling the source/drain trench. The second layer includes a first lower side wall facing a side wall of the first nanosheet and an opposite second lower side wall. A lower surface connects the first and second lower side walls and extends in the first horizontal direction. The first and second lower side walls of the second layer extend to have a constant slope in opposite directions to each other.

    SEMICONDUCTOR DEVICE
    2.
    发明公开

    公开(公告)号:US20240145541A1

    公开(公告)日:2024-05-02

    申请号:US18313630

    申请日:2023-05-08

    CPC classification number: H01L29/0673 H01L29/42392 H01L29/775 H01L29/78696

    Abstract: A semiconductor device includes an active pattern including a lower pattern extending in a first direction, and a plurality of sheet patterns spaced apart from the lower pattern in a second direction. The sheet patterns include an uppermost sheet pattern and a plurality of gate structures on the lower pattern and spaced apart from each other in the first direction. Each of the plurality of gate structures includes a gate electrode and a gate insulating film and a source/drain pattern between adjacent ones of the plurality of gate structures. Each of inner gate structures includes a gate electrode and a gate insulating film. A semiconductor liner film includes silicon-germanium, and contacts the gate insulating film of each of the inner gate structures. A portion of the semiconductor liner film protrudes upwardly in the first direction beyond an upper surface of the uppermost sheet pattern.

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