公开(公告)号：US20140197861A1

公开(公告)日：2014-07-17

申请号：US14077485

申请日：2013-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Chul Lee ,  Nam-Hong Lee ,  Kyung-Sook Lee ,  Jung-Hyun Park ,  Sang-Youl Lee

IPC: G01R31/26

CPC classification number: G01R31/2867 ,  G01R31/287 ,  G01R31/2893 ,  G01R31/2894

Abstract: A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.

Abstract translation: 使用测试设备测试半导体器件的方法包括在测试设备中加载包括单元PCB的未分隔的印刷电路板（PCB）。 半导体器件安装在每个单元PCB中。 确认装在测试设备中的未分配PCB的产品信息。 其产品信息已被确认的未分割的PCB电连接到测试设备的多个主测试仪中的一个。 每个主要测试人员都包含一个直接连接到云服务器的主测试界面，其中存储了各种测试的固件。 未分割PCB的产品信息传输到电气连接到未分割PCB的主测试仪。 产品信息传输的主要测试仪使用产品信息对未分割的PCB进行主要测试。 从主试验机进行主试验的未分割PCB从试验装置卸载。

公开(公告)号：US09618568B2

公开(公告)日：2017-04-11

申请号：US14077485

申请日：2013-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Chul Lee ,  Nam-Hong Lee ,  Kyung-Sook Lee ,  Jung-Hyun Park ,  Sang-Youl Lee

IPC: G01R31/20 ,  G01R31/26 ,  H01R12/52 ,  H01R12/00 ,  G01R31/28

CPC classification number: G01R31/2867 ,  G01R31/287 ,  G01R31/2893 ,  G01R31/2894

Abstract: A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.