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公开(公告)号：US20230392925A1
公开(公告)日：2023-12-07
申请号：US18123788
申请日：2023-03-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jiyoung Chu , Hyungjin Kim , Minhwan Seo , Wondon Joo , Dongyoon Koo , Sangwoo Bae , Sungmin Ahn , Jungyu Lee , Yunpyo Hong
CPC classification number: G01B11/272 , G02B27/283 , G02B27/286 , G02B5/0808
Abstract: A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.
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公开(公告)号：US20220170792A1
公开(公告)日：2022-06-02
申请号：US17365592
申请日：2021-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungho Jang , Jungchul Lee , Jinseob Kim , Gwangsik Park , Minhwan Seo , Janghwi Lee , Wondon Joo , Jiyoung Chu , Daehoon Han
Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.
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公开(公告)号：US11898912B2
公开(公告)日：2024-02-13
申请号：US17365592
申请日：2021-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungho Jang , Jungchul Lee , Jinseob Kim , Gwangsik Park , Minhwan Seo , Janghwi Lee , Wondon Joo , Jiyoung Chu , Daehoon Han
CPC classification number: G01J3/2823 , G01J3/021 , G01J3/04 , G01J3/24 , G01J2003/2826
Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.
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公开(公告)号：US20250052559A1
公开(公告)日：2025-02-13
申请号：US18620802
申请日：2024-03-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Minhwan Seo , Jiyoung Chu , Hyungjin Kim , Sangwoo Bae , Seungyeol Oh
IPC: G01B9/02015 , G01B9/02001 , G01B11/27 , G02B27/28
Abstract: A parallelism measurement optical system module includes a polarization beam splitter, a mirror positioned on a first surface of the polarization beam splitter, a first quarter wave plate positioned on a second surface of the polarization beam splitter that is perpendicular to the first surface, and a second quarter wave plate positioned on a third surface of the polarization beam splitter that is perpendicular to the first surface and parallel to the second surface.
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Patent Agency Ranking
公开(公告)号：US11823927B2
公开(公告)日：2023-11-21
申请号：US17229197
申请日：2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
CPC classification number: H01L21/67288 , G01N21/41 , G01N21/65 , G01N21/9505 , G02B7/021 , G06T5/20 , G06T7/0004 , G01N2021/653 , G01N2201/06113 , G06T2207/30148
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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公开(公告)号：US20240118072A1
公开(公告)日：2024-04-11
申请号：US18215437
申请日：2023-06-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungho Jang , Sangwoo Bae , Minhwan Seo , Jangwoon Sung , Akinori Okubo , Seungwoo Lee , Jungchul Lee , Jaehwang Jung , Sangjoon Hong
CPC classification number: G01B11/0608 , G01B9/02041 , G01B2290/70
Abstract: Provided are a level sensor configured to detect a height level of a substrate, and a substrate processing apparatus including the level sensor. The level sensor includes a measurement light source configured to radiate measurement light toward the substrate, a prism configured to split reflected light of the measurement light into first polarized light and second polarized light and generate a first optical path length difference between the first polarized light and the second polarized light, an optical path length modulator configured to keep constant an optical path length of the first polarized light and periodically change an optical path length of the second polarized light, and a detector configured to detect the first optical path length difference based on an interference signal between the first polarized light and the second polarized light.
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7.发明授权公开(公告)号：US11946809B2
公开(公告)日：2024-04-02
申请号：US17740529
申请日：2022-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ingi Kim , Minhwan Seo , Sangwoo Bae , Akinori Okubo , Jungchul Lee , Eunhee Jeang
Abstract: Provided is a polarization measuring device including a stage on which a measurement target is provided, a light source assembly configured to emit incident light, a first polarimeter configured to polarize the incident light, a second polarimeter configured to polarize reflected light reflected from the measurement target that is irradiated by the incident light, a filter assembly configured to remove noise from the reflected light, and a detector configured to receive the reflected light and measure an intensity of the reflected light and a phase of the reflected light.
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公开(公告)号：US11823961B2
公开(公告)日：2023-11-21
申请号：US17021087
申请日：2020-09-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunhee Jeang , Boris Afinogenov , Sangwoo Bae , Wondon Joo , Maksim Riabko , Anton Medvedev , Aleksandr Shorokhov , Anton Sofronov , Ingi Kim , Taehyun Kim , Minhwan Seo , Sangmin Lee , Seulgi Lee
CPC classification number: H01L22/12 , G01N21/648 , G01N21/9505 , H01L21/67288 , G01N2201/06113
Abstract: A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.
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公开(公告)号：US20220068681A1
公开(公告)日：2022-03-03
申请号：US17229197
申请日：2021-04-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghun Han , Ingi Kim , Sangwoo Bae , Jungchul Lee , Minhwan Seo , Myeongock Ko , Youngjoo Lee , Taehyun Kim , Seulgi Lee
Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.
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