公开(公告)号：US11828952B2

公开(公告)日：2023-11-28

申请号：US17218891

申请日：2021-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Kyungsik Kang ,  Kyungbin Park ,  Motoshi Sakai ,  Seungkoo Lee ,  Jungchul Lee

IPC: G02B27/10 ,  H05G2/00 ,  G02B27/14 ,  H01S3/00 ,  H01S3/23 ,  G03F7/00 ,  H01S3/223

CPC classification number: G02B27/1073 ,  G02B27/106 ,  G02B27/108 ,  G02B27/141 ,  G03F7/70191 ,  H01S3/0071 ,  H01S3/2308 ,  H01S3/2383 ,  H05G2/008 ,  H01S3/2232

Abstract: A light source capable of operating third and fourth reflection mirrors included in a beam splitting device in conjunction with movements of first and second reflection mirrors included in a beam transfer device and an optical assembly, respectively. The third and fourth reflection mirrors are disposed on optical paths of a pre-pulse and a main pulse emitted from first and second pulse generators, respectively. The light source operates the third and fourth reflection mirrors to offset an excessive compensation of the main pulse caused in a process of compensating for an optical path error of the pre-pulse. The light source may be included in an extreme ultraviolet light source system.

公开(公告)号：US20220066225A1

公开(公告)日：2022-03-03

申请号：US17218891

申请日：2021-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Kyungsik Kang ,  Kyungbin Park ,  Motoshi Sakai ,  Seungkoo Lee ,  Jungchul Lee

IPC: G02B27/10 ,  H05G2/00 ,  G02B27/14 ,  H01S3/00 ,  H01S3/23 ,  G03F7/20

Abstract: A light source capable of operating third and fourth reflection mirrors included in a beam splitting device in conjunction with movements of first and second reflection mirrors included in a beam transfer device and an optical assembly, respectively. The third and fourth reflection mirrors are disposed on optical paths of a pre-pulse and a main pulse emitted from first and second pulse generators, respectively. The light source operates the third and fourth reflection mirrors to offset an excessive compensation of the main pulse caused in a process of compensating for an optical path error of the pre-pulse. The light source may be included in an extreme ultraviolet light source system.

公开(公告)号：US12185450B2

公开(公告)日：2024-12-31

申请号：US18628152

申请日：2024-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Insung Kim ,  Jinhong Park ,  Jungchul Lee

IPC: H05G2/00 ,  G03F7/00 ,  H01L21/268

Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.

公开(公告)号：US11823927B2

公开(公告)日：2023-11-21

申请号：US17229197

申请日：2021-04-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghun Han ,  Ingi Kim ,  Sangwoo Bae ,  Jungchul Lee ,  Minhwan Seo ,  Myeongock Ko ,  Youngjoo Lee ,  Taehyun Kim ,  Seulgi Lee

IPC: G01J3/14 ,  H01L21/67 ,  G02B7/02 ,  G06T5/20 ,  G06T7/00 ,  G01N21/41 ,  G01N21/95 ,  G01N21/65

CPC classification number: H01L21/67288 ,  G01N21/41 ,  G01N21/65 ,  G01N21/9505 ,  G02B7/021 ,  G06T5/20 ,  G06T7/0004 ,  G01N2021/653 ,  G01N2201/06113 ,  G06T2207/30148

Abstract: A wafer inspection apparatus includes: an objective lens on an optical path of first and second input beams; and an image sensor configured to generate an image of the wafer based on scattered light according to a nonlinear optical phenomenon based on the first and second input beams, wherein the first input beam passing through the objective lens is obliquely incident on the wafer at a first incident angle with respect to a vertical line that is normal to an upper surface of the wafer, the second input beam passing through the objective lens is incident on the wafer at a second incident angle oblique to the vertical line that is normal to the upper surface of the wafer, and the first and second incident angles are different from each other.

公开(公告)号：US11322405B2

公开(公告)日：2022-05-03

申请号：US16909136

申请日：2020-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Yoon ,  Jungchul Lee ,  Byungmoon Bae ,  Junggeun Shin ,  Hyunsu Sim

IPC: G11B11/105 ,  B23K26/00 ,  B23K26/40 ,  H01L21/78 ,  H01L21/268 ,  H01L21/683 ,  H01L21/304

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

公开(公告)号：US11979973B2

公开(公告)日：2024-05-07

申请号：US17163945

申请日：2021-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Insung Kim ,  Jinhong Park ,  Jungchul Lee

IPC: H05G2/00 ,  G03F7/00 ,  H01L21/268

CPC classification number: H05G2/008 ,  H01L21/268 ,  G03F7/70033

Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.

公开(公告)号：US11898912B2

公开(公告)日：2024-02-13

申请号：US17365592

申请日：2021-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Jungchul Lee ,  Jinseob Kim ,  Gwangsik Park ,  Minhwan Seo ,  Janghwi Lee ,  Wondon Joo ,  Jiyoung Chu ,  Daehoon Han

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/24 ,  G01J3/04

CPC classification number: G01J3/2823 ,  G01J3/021 ,  G01J3/04 ,  G01J3/24 ,  G01J2003/2826

Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.

公开(公告)号：US11854892B2

公开(公告)日：2023-12-26

申请号：US17699570

申请日：2022-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Yoon ,  Jungchul Lee ,  Byungmoon Bae ,  Junggeun Shin ,  Hyunsu Sim

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683 ,  H01L21/304

CPC classification number: H01L21/78 ,  H01L21/268 ,  H01L21/304 ,  H01L21/6836 ,  H01L2221/68336

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

公开(公告)号：US20210385932A1

公开(公告)日：2021-12-09

申请号：US17163945

申请日：2021-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Insung Kim ,  Jinhong Park ,  Jungchul Lee

IPC: H05G2/00 ,  H01L21/268

Abstract: Disclosed are semiconductor manufacturing apparatuses and operating methods thereof. The semiconductor manufacturing apparatus includes an oscillation unit that includes a first seed laser, a second seed laser, and a seed module, wherein the first seed laser oscillates a first pulse, and wherein the second seed laser oscillates a second pulse, and an extreme ultraviolet generation unit configured to use the first and second pulses to generate extreme ultraviolet light. The seed module includes a plurality of mirrors configured to allow the first and second pulses to travel along first and second paths, respectively, and a pulse control optical system including a first optical element, a second optical element, and a third optical element. The pulse control optical system is on the second path that does not overlap the first path. The third optical element includes a lens between the first optical element and the second optical element.

公开(公告)号：US11778719B2

公开(公告)日：2023-10-03

申请号：US16927050

申请日：2020-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dohyung Kim ,  Seongchul Hong ,  Kyungsik Kang ,  Insung Kim ,  Motoshi Sakai ,  Seulgi Lee ,  Jungchul Lee

IPC: H01S3/23 ,  H05G2/00 ,  G02B26/08 ,  H01S3/00 ,  G02B19/00

CPC classification number: H05G2/008 ,  G02B19/0047 ,  G02B26/0816 ,  G02B26/0875 ,  H01S3/0071 ,  H01S3/2316

Abstract: A laser beam delivery apparatus of an extreme ultra violet light source may include a high power seed module configured to generate a laser beam, a power amplifier configured to amplify the laser beam generated by the high power seed module, a beam transfer module configured to collect and move the laser beam amplified by the power amplifier, a final focusing assembly optical platform configured to adjust focus of the laser beam collected and moved by the beam transfer module, and a focusing unit configured to focus the laser beam with the focus adjusted by the final focusing assembly optical platform to a target droplet. The power amplifier may include a position adjuster configured to adjust a position of the laser beam. The position adjuster may include a refraction plate having a flat surface. The power amplifier may include a pointing adjuster, which may include a mirror.