APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20230028347A1

    公开(公告)日:2023-01-26

    申请号:US17684052

    申请日:2022-03-01

    Abstract: A method for fabricating a semiconductor device is provided. The method includes: loading a substrate on a stage of an apparatus for inspecting the substrate; extracting a first light having a first wavelength from a light by using a light source; acquiring first position information on at least one focal point, formed on the substrate, based on the first wavelength by using a controller, the at least one focal point being a pre-calculated at least one focal point; adjusting a position of at least one from among an objective lens and at least one microsphere in a vertical direction by using the first position information in the controller; condensing the first light, which has passed through the at least one microsphere, on the at least one focal point formed on the substrate; and inspecting the substrate by using the first light condensed on the at least one focal point.

Patent Agency Ranking