公开(公告)号：US10915257B2

公开(公告)日：2021-02-09

申请号：US15806640

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung Kyoon Yim ,  Ho Yeon Jeon ,  Sang Woo Han ,  Taek Kyun Shin ,  Woo Sung Lee ,  Seung Hyun Choi

IPC: G06F1/3206 ,  G06F3/06 ,  G06F1/3296 ,  G06F15/78 ,  G06F1/3234

Abstract: A semiconductor device and a semiconductor system are provided. A semiconductor device includes a monitoring circuit receiving a first operating voltage and a second operating voltage, which is different from the first operating voltage, from a Power Management Integrated Circuit (PMIC) and monitoring a duration of use of a System-on-Chip (SoC) at each of the first and second operating voltages; a processing circuit calculating a normalized value based on predetermined weight information from the duration of use of the SoC at each of the first and second operating voltages; and a voltage circuit determining whether to increase an operating voltage of the SoC by comparing the normalized value with a predetermined value.

公开(公告)号：US10484780B2

公开(公告)日：2019-11-19

申请号：US16390608

申请日：2019-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Woo Han ,  Ji Ho Lee ,  Hyun Jung Lee

IPC: H04R1/10 ,  G06F3/01 ,  A61B5/00 ,  G06F3/0481 ,  G06F3/0488 ,  A61B5/024

Abstract: Systems, methods, and audio output devices are described. In one aspect, an audio output device includes a communication module that communicates with an external electronic device, a speaker that outputs sound, a mounting detection sensor that detects whether the audio output device is mounted on a user of the audio output device, and a control circuit that is electrically connected with the communication module, the speaker, and the mounting detection sensor. The control circuit wirelessly connects the external electronic device with the audio output device using the communication module if the mounting of the audio output device is detected by the mounting detection sensor, receives audio data from the external electronic device through the wireless connection, and outputs the audio data using the speaker.

公开(公告)号：US10313776B2

公开(公告)日：2019-06-04

申请号：US15399140

申请日：2017-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Woo Han ,  Ji Ho Lee ,  Hyun Jung Lee

IPC: H04R1/10 ,  G06F3/0481 ,  G06F3/0488 ,  A61B5/024 ,  A61B5/00 ,  G06F3/01

Abstract: Systems, methods, and audio output devices are described. In one aspect, an audio output device includes a communication module that communicates with an external electronic device, a speaker that outputs sound, a mounting detection sensor that detects whether the audio output device is mounted on a user of the audio output device, and a control circuit that is electrically connected with the communication module, the speaker, and the mounting detection sensor. The control circuit wirelessly connects the external electronic device with the audio output device using the communication module if the mounting of the audio output device is detected by the mounting detection sensor, receives audio data from the external electronic device through the wireless connection, and outputs the audio data using the speaker.

公开(公告)号：US09615161B2

公开(公告)日：2017-04-04

申请号：US14837583

申请日：2015-08-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： In Ho Baek ,  So Young Lee ,  Ji Yeon Jung ,  Sang Woo Han ,  Chang Ryong Heo ,  In Seok Shim

IPC: H04R1/10 ,  G06F1/16 ,  H04B1/3827 ,  H04M1/02 ,  H04M1/05 ,  H04M1/60 ,  H04R1/02 ,  H04R5/033

CPC classification number: H04R1/1041 ,  G06F1/163 ,  G06F3/165 ,  H04B1/385 ,  H04M1/0241 ,  H04M1/05 ,  H04M1/6041 ,  H04R1/028 ,  H04R1/105 ,  H04R1/1091 ,  H04R5/0335 ,  H04R29/001 ,  H04R2420/07

Abstract: A wearable electronic device is provided. The wearable electronic device includes a first part including a first sound output module, a second part including a second sound output module, a third part disposed between the first part and the second part, a flexible first connection unit configured to connect a first end of the first part and a first end of the third part, and a flexible second connection unit configured to connect a first end of the second part and a second end of the third part.

公开(公告)号：US20180225053A1

公开(公告)日：2018-08-09

申请号：US15806640

申请日：2017-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung Kyoon Yim ,  Ho Yeon Jeon ,  Sang Woo Han ,  Taek Kyun Shin ,  Woo Sung Lee ,  Seung Hyun Choi

IPC: G06F3/06 ,  G06F1/32 ,  G06F15/78

CPC classification number: G06F3/0625 ,  G06F1/3206 ,  G06F1/3243 ,  G06F1/3296 ,  G06F3/065 ,  G06F3/0679 ,  G06F15/7821

Abstract: A semiconductor device and a semiconductor system are provided. A semiconductor device includes a monitoring circuit receiving a first operating voltage and a second operating voltage, which is different from the first operating voltage, from a Power Management Integrated Circuit (PMIC) and monitoring a duration of use of a System-on-Chip (SoC) at each of the first and second operating voltages; a processing circuit calculating a normalized value based on predetermined weight information from the duration of use of the SoC at each of the first and second operating voltages; and a voltage circuit determining whether to increase an operating voltage of the SoC by comparing the normalized value with a predetermined value.

公开(公告)号：US09955248B2

公开(公告)日：2018-04-24

申请号：US15438038

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： In Ho Baek ,  So Young Lee ,  Ji Yeon Jung ,  Sang Woo Han ,  Chang Ryong Heo ,  In Seok Shim

IPC: H04R1/10 ,  G06F1/16 ,  H04B1/3827 ,  H04M1/02 ,  H04M1/05 ,  G06F3/16 ,  H04R29/00 ,  H04M1/60 ,  H04R1/02 ,  H04R5/033

CPC classification number: H04R1/1041 ,  G06F1/163 ,  G06F3/165 ,  H04B1/385 ,  H04M1/0241 ,  H04M1/05 ,  H04M1/6041 ,  H04R1/028 ,  H04R1/105 ,  H04R1/1091 ,  H04R5/0335 ,  H04R29/001 ,  H04R2420/07

Abstract: A wearable electronic device is provided. The wearable electronic device includes a first part including a first sound output module, a second part including a second sound output module, a third part disposed between the first part and the second part, a flexible first connection unit configured to connect a first end of the first part and a first end of the third part, and a flexible second connection unit configured to connect a first end of the second part and a second end of the third part.