公开(公告)号：US20130321041A1

公开(公告)日：2013-12-05

申请号：US13830651

申请日：2013-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaechoon Kim ,  SangWook Ju ,  Eunseok Cho

IPC: H03K3/011

CPC classification number: H03K3/011 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F11/3058 ,  Y02D10/126

Abstract: A method for controlling a temperature of an electronic device which includes a semiconductor chip is provided. The temperature control method includes measuring a temperature of a measurement point using the electronic device, comparing the temperature of the measurement point with a target temperature varying according to a period of time when the semiconductor chip operates using the electronic device, and decreasing a clock frequency of the semiconductor chip using the electronic device when the temperature of the measurement point is higher than the target temperature.

Abstract translation: 提供了一种用于控制包括半导体芯片的电子设备的温度的方法。 温度控制方法包括使用电子装置测量测量点的温度，将测量点的温度与根据半导体芯片使用电子设备操作的时间段变化的目标温度进行比较，并且降低时钟频率 当测量点的温度高于目标温度时，使用电子器件的半导体芯片。

公开(公告)号：US08988115B2

公开(公告)日：2015-03-24

申请号：US13830651

申请日：2013-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaechoon Kim ,  SangWook Ju ,  Eunseok Cho

IPC: H01L35/00 ,  H03K3/011 ,  G06F1/20 ,  G06F1/32 ,  G06F11/30

CPC classification number: H03K3/011 ,  G06F1/203 ,  G06F1/206 ,  G06F1/324 ,  G06F11/3058 ,  Y02D10/126

Abstract: A method for controlling a temperature of an electronic device which includes a semiconductor chip is provided. The temperature control method includes measuring a temperature of a measurement point using the electronic device, comparing the temperature of the measurement point with a target temperature varying according to a period of time when the semiconductor chip operates using the electronic device, and decreasing a clock frequency of the semiconductor chip using the electronic device when the temperature of the measurement point is higher than the target temperature.

Abstract translation: 提供了一种用于控制包括半导体芯片的电子设备的温度的方法。 温度控制方法包括使用电子装置测量测量点的温度，将测量点的温度与根据半导体芯片使用电子设备操作的时间段变化的目标温度进行比较，并且降低时钟频率 当测量点的温度高于目标温度时，使用电子器件的半导体芯片。