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公开(公告)号：US20200012362A1
公开(公告)日：2020-01-09
申请号：US16575204
申请日：2019-09-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seo Hyun Kim , Seung Taek Oh , Seok Gyu Lee
Abstract: An electronic device includes a processor and a housing having a first surface, a second surface, and a side surface. A touch screen display is exposed through a first area of the first surface. An optical sensor is disposed under a second area of the first surface that is adjacent to the first area. The optical sensor receives and/or emits an infrared ray. The first surface includes a substantially transparent glass layer, an opaque layer disposed between the glass layer and the second surface, and a color layer disposed between the opaque layer and the glass layer. The opaque layer includes an opening, a location and a size of which correspond to at least a portion of the optical sensor when viewed from the first surface. The optical sensor receives and/or emits the infrared ray through the opening, the color layer, and the glass layer.
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Patent Agency Ranking
公开(公告)号：US20220084812A1
公开(公告)日：2022-03-17
申请号：US17318629
申请日：2021-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung Hyun Park , Seo Hyun Kim , Seung Ho Kim , Young Chan Kim , Young-Hoo Kim , Tae-Hong Kim , Hyun Woo Nho , Seung Min Shin , Kun Tack Lee , Hun Jae Jang
Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
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公开(公告)号：US10459548B2
公开(公告)日：2019-10-29
申请号：US15629614
申请日：2017-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seo Hyun Kim , Seung Taek Oh , Seok Gyu Lee
Abstract: An electronic device includes a processor and a housing having a first surface, a second surface, and a side surface. A touch screen display is exposed through a first area of the first surface. An optical sensor is disposed under a second area of the first surface that is adjacent to the first area. The optical sensor receives and/or emits an infrared ray. The first surface includes a substantially transparent glass layer, an opaque layer disposed between the glass layer and the second surface, and a color layer disposed between the opaque layer and the glass layer. The opaque layer includes an opening, a location and a size of which correspond to at least a portion of the optical sensor when viewed from the first surface. The optical sensor receives and/or emits the infrared ray through the opening, the color layer, and the glass layer.
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公开(公告)号：US09907193B2
公开(公告)日：2018-02-27
申请号：US15200122
申请日：2016-07-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ha Lim Lee , Myung Gon Kim , Jung Hyun Kim , Soon Ho Han , Tae Kon Kim , Hyun Suk Shin , Seo Hyun Kim , Kun Chan Seo , Seung Hoon Lee , Jong Chul Choi
CPC classification number: H05K5/0217 , H04B1/3888 , H04M1/0266 , H04M1/185 , H05K5/0017 , H05K5/03
Abstract: Disclosed is an electronic device including a housing with a first surface facing a first direction and a second surface facing a second, opposite direction. A glass cover may form at least a portion of the first surface. A display may be exposed through the glass cover. At least one protrusion is configured to absorb external impact to the electronic device. The protrusion protrudes from the first surface and is formed as part of the glass cover or protrudes through a hole in the glass cover.
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公开(公告)号：US12165866B2
公开(公告)日：2024-12-10
申请号：US17318629
申请日：2021-05-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sung Hyun Park , Seo Hyun Kim , Seung Ho Kim , Young Chan Kim , Young-Hoo Kim , Tae-Hong Kim , Hyun Woo Nho , Seung Min Shin , Kun Tack Lee , Hun Jae Jang
Abstract: A wafer cleaning method is provided. The wafer cleaning method includes providing a wafer on a stage that is inside of a chamber. The wafer is fixed to the stage by moving a grip pin connected to an edge of the stage. First ultrapure water is supplied onto the wafer while the wafer is rotating at a first rotation speed. The grip pin is released from the wafer by moving the grip pin. A development process is performed by supplying liquid chemical onto the wafer while the wafer is rotating at a second rotation speed that is less than the first rotation speed.
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公开(公告)号：US20170364172A1
公开(公告)日：2017-12-21
申请号：US15629614
申请日：2017-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seo Hyun Kim , Seung Taek Oh , Seok Gyu Lee
CPC classification number: G06F3/041 , G02B5/003 , G02B5/208 , G06F1/16 , G06F1/1626 , G06F1/1637 , G06F1/1643 , G06F1/1684 , G06F1/1686
Abstract: An electronic device includes a processor and a housing having a first surface, a second surface, and a side surface. A touch screen display is exposed through a first area of the first surface. An optical sensor is disposed under a second area of the first surface that is adjacent to the first area. The optical sensor receives and/or emits an infrared ray. The first surface includes a substantially transparent glass layer, an opaque layer disposed between the glass layer and the second surface, and a color layer disposed between the opaque layer and the glass layer. The opaque layer includes an opening, a location and a size of which correspond to at least a portion of the optical sensor when viewed from the first surface. The optical sensor receives and/or emits the infrared ray through the opening, the color layer, and the glass layer.
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