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    Semiconductor package with curing layer between semiconductor chips
    1.
    发明授权
    Semiconductor package with curing layer between semiconductor chips 有权

    公开(公告)号：US11842982B2

    公开(公告)日：2023-12-12

    申请号：US17329230

    申请日：2021-05-25

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seon Ho Lee ,  Hwail Jin ,  Jongpa Hong

    IPC: H01L25/065 ,  H01L25/00

    CPC classification number: H01L25/0652 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06586

    Abstract: A semiconductor package includes a lower semiconductor chip having a lower semiconductor substrate and upper pads on a top surface of the lower semiconductor substrate, an upper semiconductor chip stacked on the lower semiconductor chip, the upper semiconductor chip including an upper semiconductor substrate and solder bumps on a bottom surface of the upper semiconductor substrate, and a curing layer between the lower semiconductor chip and the upper semiconductor chip, the curing layer including a first curing layer adjacent to the upper semiconductor chip, the first curing layer including a first photo-curing agent, and a second curing layer between the first curing layer and the top surface of the lower semiconductor substrate, the second curing layer including a first thermo-curing agent.

    DEFORMABLE WEARABLE ELECTRONIC DEVICE
    3.
    发明申请
    DEFORMABLE WEARABLE ELECTRONIC DEVICE 有权
    不可磨损的电子设备

    公开(公告)号：US20160224305A1

    公开(公告)日：2016-08-04

    申请号：US14993286

    申请日：2016-01-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seon Ho Lee ,  Jin Hak Lee

    IPC: G06F3/14 ,  G06F3/041 ,  G06F1/16

    CPC classification number: G06F3/041 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/013 ,  G06F3/014 ,  G06F3/017 ,  G06F3/0488 ,  G06F3/147 ,  G06F2203/04102 ,  G09G3/001 ,  G09G2340/0464 ,  G09G2354/00 ,  G09G2380/02

    Abstract: A wearable electronic device includes: a flexible display divided into a plurality of blocks, at least one block among the plurality of blocks configured to be folded, and at least one magnetic element disposed at both ends of the at least one block configured to be folded, said magnetic element configured to connect unfolded blocks to each other from among the plurality of blocks by connecting both ends of the at least one block configured to be folded when the at least one block configured to be folded is folded.

    Abstract translation: 一种可佩戴的电子设备包括：分为多个块的柔性显示器，被配置为折叠的所述多个块中的至少一个块，以及设置在所述至少一个块的两端的至少一个磁性元件，被配置为被折叠 所述磁性元件被构造成通过连接构造成待折叠的至少一个块折叠的待折叠的至少一个块的两个端部，从而将多个块中的展开块彼此连接。

    Method of fabricating a semiconductor package
    5.
    发明授权
    Method of fabricating a semiconductor package 有权

    公开(公告)号：US11521863B2

    公开(公告)日：2022-12-06

    申请号：US17197274

    申请日：2021-03-10

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seon Ho Lee ,  Yeonseok Kim ,  Eunyeong Kim

    IPC: H01L21/48 ,  H01L25/00 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065

    Abstract: Disclosed is a method of fabricating a semiconductor package. The method may include providing a preliminary interposer substrate including connection terminals on a carrier substrate such that the connection terminals are oriented outward, preparing a release film including a base layer, an intermediate layer, and an adhesive layer, attaching the connection terminals to a first surface of the release film, detaching the carrier substrate from the preliminary interposer substrate, cutting the preliminary interposer substrate to form a plurality of interposer substrates separated from each other, irradiating a first light of a first wavelength onto the release film to form an air gap between the connection terminals and the release film, and detaching the interposer substrates from the release film. The intermediate substrate may include a light absorber absorbing the first light.

    Electronic device and method for managing data input into input field
    6.
    发明授权
    Electronic device and method for managing data input into input field 有权

    公开(公告)号：US11327818B2

    公开(公告)日：2022-05-10

    申请号：US16197789

    申请日：2018-11-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bu Nam Jeon ,  Kyung Tae Kim ,  Ho Sung You ,  Seon Ho Lee ,  Yoon Jeong Choi ,  Tae Ho Ha ,  Chang Ho Lee

    IPC: G06F9/54 ,  G06F16/957 ,  G06F40/274 ,  G06F3/0482 ,  G06F3/04842 ,  G06F3/0488 ,  H04L67/75

    Abstract: An electronic device and method are disclosed. The electronic device includes a processor which implements the method. The method includes: executing an application in a first state, displaying a first user interface for the application on a display, the first UI including a first input field and a first identifier identifying the first input field, receiving data input to the first input field, in response to detecting a particular event, changing the first operational state to a second operational state, re-executing the application in the second operational state, transmitting data for a second UI of the re-executed application to an external display device for display, the second UI including a second input field and a second identifier corresponding to the second input field, and inserting the received data input into the second input field when the first identifier corresponds to the second identifier.

    SEMICONDUCTOR PACKAGE
    7.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20200168565A1

    公开(公告)日：2020-05-28

    申请号：US16406951

    申请日：2019-05-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jun Woo Myung ,  Jae Kul Lee ,  Seon Ho Lee

    IPC: H01L23/00 ,  H01L23/31

    Abstract: A semiconductor package includes a connection structure, a semiconductor chip, and an encapsulant. The connection structure includes an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer. The semiconductor chip has an active surface on which connection pads are disposed and an inactive surface opposing the active surface, and the active surface is disposed on the connection structure to face the connection structure. The encapsulant covers at least a portion of the semiconductor chip. The semiconductor chip includes a groove formed in the active surface and a dam structure disposed around the groove in the active surface.

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