公开(公告)号：US09927488B2

公开(公告)日：2018-03-27

申请号：US14959641

申请日：2015-12-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngin Kim ,  Jungho Kim ,  Jongsam Kim ,  Byung-Soo Park ,  Sookil Park ,  Byungkook Yoo ,  Seong Sil Jeong ,  Wooseong Choi

IPC: G01R31/28 ,  G01R31/26 ,  H01L21/67 ,  H01L21/68

CPC classification number: G01R31/2893

Abstract: Probe card transfer units and probe card management apparatuses including the same may be provided. The transfer unit includes a hand part including grippers holding a package and a moving part moving the hand part. Each of the grippers includes at least one locking pin protruding from a holding bar, which extends in a direction perpendicular to the holding bar, to securely hold the package.

公开(公告)号：US11982705B2

公开(公告)日：2024-05-14

申请号：US17690317

申请日：2022-03-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn Gon Oh ,  Ji Hun Kim ,  Sae Yun Ko ,  Gil Ho Gu ,  Dong Su Kim ,  Eun Hee Lee ,  Ho Chan Lee ,  Seong Sil Jeong ,  Seong Pyo Hong

IPC: G01R31/28 ,  H01L21/673 ,  H01L21/677

CPC classification number: G01R31/2831 ,  H01L21/6735 ,  H01L21/6773

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

公开(公告)号：US10197617B2

公开(公告)日：2019-02-05

申请号：US14955432

申请日：2015-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngin Kim ,  Jongsam Kim ,  Byung-Soo Park ,  Sookil Park ,  Byungkook Yoo ,  Younghyen Lee ,  Seong Sil Jeong ,  Wooseong Choi

IPC: G01R31/26 ,  G01R31/28

Abstract: A loading apparatus is provided which includes a package jig, a transfer unit, and a load port. The package jig is fixed to a package. The transfer unit includes a hand for holding the package jig and transferring the package. The package transferred by the transfer unit is loaded on the load port. The load port and the hand include first alignment pins and first alignment sockets for aligning the package to the load port.