SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20170069570A1

    公开(公告)日:2017-03-09

    申请号:US15229518

    申请日:2016-08-05

    摘要: In a semiconductor device and a method of manufacturing the same a fuse structure may be formed during formation of first to third contact plugs connected to a transistor. The fuse structure may include first and second fuse contact plugs having the same height as the first and second contact plugs, and a connection pattern having the same height as the third contact plug. The connection pattern may be connected between the first and second fuse contact plugs.

    摘要翻译: 在半导体器件及其制造方法中,可在形成连接到晶体管的第一至第三接触插塞的形成期间形成熔丝结构。 熔丝结构可以包括具有与第一和第二接触插塞相同的高度的第一和第二熔丝接触插塞,以及具有与第三接触插塞相同高度的连接图案。 连接图案可以连接在第一和第二熔丝接触插头之间。