公开(公告)号：US11056416B2

公开(公告)日：2021-07-06

申请号：US16534057

申请日：2019-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suin Kim ,  Jiyong Kim ,  Sung-Ki Lee

IPC: H01L23/367 ,  H01L23/02 ,  G11C5/04 ,  H05K5/02

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

公开(公告)号：US11061449B2

公开(公告)日：2021-07-13

申请号：US16872896

申请日：2020-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyong Kim ,  Suin Kim ,  Teck Su Oh ,  Sung-Ki Lee

IPC: G06F1/18 ,  G06F1/20 ,  G06F3/06

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

公开(公告)号：US20240194614A1

公开(公告)日：2024-06-13

申请号：US18342182

申请日：2023-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suin Kim ,  Insub Kwak ,  Hanhong Lee ,  Sungki Lee

IPC: H01L23/552 ,  G06F1/18 ,  H01L23/495 ,  H01L23/528 ,  H01L25/18 ,  H05K9/00 ,  H10B80/00

CPC classification number: H01L23/552 ,  G06F1/182 ,  H01L23/49503 ,  H01L23/5286 ,  H01L25/18 ,  H05K9/0024 ,  H10B80/00

Abstract: A solid state drive apparatus includes a case including an upper wall and a lower wall, a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case, a first semiconductor chip on the first surface of the substrate, and a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads, wherein the first shielding structure includes a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and wherein each of the plurality of first unit shielding structures includes an elastic body.

公开(公告)号：US11782489B2

公开(公告)日：2023-10-10

申请号：US17338835

申请日：2021-06-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyong Kim ,  Suin Kim ,  Teck Su Oh ,  Sung-Ki Lee

IPC: G06F1/18 ,  G06F1/20 ,  G06F3/06

CPC classification number: G06F1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F3/0679

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.

公开(公告)号：US12069818B2

公开(公告)日：2024-08-20

申请号：US17715385

申请日：2022-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilhan Yun ,  Sungki Lee ,  Suin Kim

IPC: H05K5/02

CPC classification number: H05K5/0208

Abstract: A solid state drive case includes a lower cover having a sidewall defining an internal space. The sidewall includes a protrusion disposed on an end portion of the sidewall. An upper cover has a first surface directly contacting the sidewall of the lower cover and a second surface opposite to the first surface. The upper cover has a hole overlapping the protrusion and configured to receive the protrusion. A sealing label is attached to the second surface of the upper cover. The sealing label has an area that is less than an area of an entirety of the second surface of the cover. At least a portion of the sealing label is attached to an end portion of the protrusion.

公开(公告)号：US11688661B2

公开(公告)日：2023-06-27

申请号：US17332574

申请日：2021-05-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suin Kim ,  Jiyong Kim ,  Sung-Ki Lee

IPC: H01L23/367 ,  H05K5/02 ,  G11C5/04 ,  H01L23/02

CPC classification number: H01L23/3677 ,  G11C5/04 ,  H01L23/02 ,  H05K5/0256

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

公开(公告)号：US10678311B2

公开(公告)日：2020-06-09

申请号：US16260278

申请日：2019-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyong Kim ,  Suin Kim ,  Teck Su Oh ,  Sung-Ki Lee

IPC: G06F1/18 ,  G06F1/20 ,  G06F3/06

Abstract: A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.