公开(公告)号：US11281812B2

公开(公告)日：2022-03-22

申请号：US17123538

申请日：2020-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F21/78 ,  H05K5/02

Abstract: A storage device includes a substrate, at least one secure element, a case and a coupling structure. The secure element is mounted on the substrate. The case surrounds the substrate and the secure element. The coupling structure integrally couples the secure element and the case. When at least a part of the case is removed, the secure element is destroyed while a connection remains between the secure element and the case by the coupling structure, and access to secure data stored in the secure element is prevented.

公开(公告)号：US20210334414A1

公开(公告)日：2021-10-28

申请号：US17130989

申请日：2020-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F21/78 ,  H01L23/00 ,  H01L23/053 ,  G06F3/06

Abstract: A storage device includes a substrate, at least one data storage element, a case, and at least one sensing pin. The substrate includes at least one security pad. The data storage element is mounted on the substrate. The case surrounds the substrate and the data storage element, and includes at least one contact structure for an electrical connection with the security pad. The sensing pin receives an electrical signal. A level of the electrical signal varies by detecting a change in a resistance according to whether the security pad is electrically connected to the contact structure. When at least a part of the case is removed, a level change of the electrical signal is detected, and a secure erase process for data stored in the data storage element is performed.

公开(公告)号：US12277256B2

公开(公告)日：2025-04-15

申请号：US17130989

申请日：2020-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F21/78 ,  G06F3/06 ,  H01L23/00 ,  H01L23/053

Abstract: A storage device includes a substrate, at least one data storage element, a case, and at least one sensing pin. The substrate includes at least one security pad. The data storage element is mounted on the substrate. The case surrounds the substrate and the data storage element, and includes at least one contact structure for an electrical connection with the security pad. The sensing pin receives an electrical signal. A level of the electrical signal varies by detecting a change in a resistance according to whether the security pad is electrically connected to the contact structure. When at least a part of the case is removed, a level change of the electrical signal is detected, and a secure erase process for data stored in the data storage element is performed.

公开(公告)号：US11856700B2

公开(公告)日：2023-12-26

申请号：US17225209

申请日：2021-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chunghyun Ryu ,  Byungok Kang ,  Su-Yong An ,  Jongwoo Jang ,  Insub Kwak ,  Teck Su Oh ,  Geurim Jung ,  Sang-Ho Park ,  Sung-Ki Lee

IPC: H01G9/08 ,  H05K1/18 ,  H01G9/008 ,  H01G9/045

CPC classification number: H05K1/182 ,  H01G9/08 ,  H01G9/008 ,  H01G9/045 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10015

Abstract: A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.

公开(公告)号：US20240194614A1

公开(公告)日：2024-06-13

申请号：US18342182

申请日：2023-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suin Kim ,  Insub Kwak ,  Hanhong Lee ,  Sungki Lee

IPC: H01L23/552 ,  G06F1/18 ,  H01L23/495 ,  H01L23/528 ,  H01L25/18 ,  H05K9/00 ,  H10B80/00

CPC classification number: H01L23/552 ,  G06F1/182 ,  H01L23/49503 ,  H01L23/5286 ,  H01L25/18 ,  H05K9/0024 ,  H10B80/00

Abstract: A solid state drive apparatus includes a case including an upper wall and a lower wall, a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case, a first semiconductor chip on the first surface of the substrate, and a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads, wherein the first shielding structure includes a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and wherein each of the plurality of first unit shielding structures includes an elastic body.

公开(公告)号：US20210334413A1

公开(公告)日：2021-10-28

申请号：US17123538

申请日：2020-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F21/78 ,  H05K5/00 ,  H05K5/02

Abstract: A storage device includes a substrate, at least one secure element, a case and a coupling structure. The secure element is mounted on the substrate. The case surrounds the substrate and the secure element. The coupling structure integrally couples the secure element and the case, When at least a part of the case is removed, the secure element is destroyed while a connection remains between the secure element and the case by the coupling structure, and access to secure data stored in the secure element is prevented.