公开(公告)号：US12277256B2

公开(公告)日：2025-04-15

申请号：US17130989

申请日：2020-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F21/78 ,  G06F3/06 ,  H01L23/00 ,  H01L23/053

Abstract: A storage device includes a substrate, at least one data storage element, a case, and at least one sensing pin. The substrate includes at least one security pad. The data storage element is mounted on the substrate. The case surrounds the substrate and the data storage element, and includes at least one contact structure for an electrical connection with the security pad. The sensing pin receives an electrical signal. A level of the electrical signal varies by detecting a change in a resistance according to whether the security pad is electrically connected to the contact structure. When at least a part of the case is removed, a level change of the electrical signal is detected, and a secure erase process for data stored in the data storage element is performed.

公开(公告)号：US12069818B2

公开(公告)日：2024-08-20

申请号：US17715385

申请日：2022-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilhan Yun ,  Sungki Lee ,  Suin Kim

IPC: H05K5/02

CPC classification number: H05K5/0208

Abstract: A solid state drive case includes a lower cover having a sidewall defining an internal space. The sidewall includes a protrusion disposed on an end portion of the sidewall. An upper cover has a first surface directly contacting the sidewall of the lower cover and a second surface opposite to the first surface. The upper cover has a hole overlapping the protrusion and configured to receive the protrusion. A sealing label is attached to the second surface of the upper cover. The sealing label has an area that is less than an area of an entirety of the second surface of the cover. At least a portion of the sealing label is attached to an end portion of the protrusion.

公开(公告)号：US20240194614A1

公开(公告)日：2024-06-13

申请号：US18342182

申请日：2023-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suin Kim ,  Insub Kwak ,  Hanhong Lee ,  Sungki Lee

IPC: H01L23/552 ,  G06F1/18 ,  H01L23/495 ,  H01L23/528 ,  H01L25/18 ,  H05K9/00 ,  H10B80/00

CPC classification number: H01L23/552 ,  G06F1/182 ,  H01L23/49503 ,  H01L23/5286 ,  H01L25/18 ,  H05K9/0024 ,  H10B80/00

Abstract: A solid state drive apparatus includes a case including an upper wall and a lower wall, a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case, a first semiconductor chip on the first surface of the substrate, and a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads, wherein the first shielding structure includes a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and wherein each of the plurality of first unit shielding structures includes an elastic body.

公开(公告)号：US20210334413A1

公开(公告)日：2021-10-28

申请号：US17123538

申请日：2020-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F21/78 ,  H05K5/00 ,  H05K5/02

Abstract: A storage device includes a substrate, at least one secure element, a case and a coupling structure. The secure element is mounted on the substrate. The case surrounds the substrate and the secure element. The coupling structure integrally couples the secure element and the case, When at least a part of the case is removed, the secure element is destroyed while a connection remains between the secure element and the case by the coupling structure, and access to secure data stored in the secure element is prevented.

公开(公告)号：US11281812B2

公开(公告)日：2022-03-22

申请号：US17123538

申请日：2020-12-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F21/78 ,  H05K5/02

Abstract: A storage device includes a substrate, at least one secure element, a case and a coupling structure. The secure element is mounted on the substrate. The case surrounds the substrate and the secure element. The coupling structure integrally couples the secure element and the case. When at least a part of the case is removed, the secure element is destroyed while a connection remains between the secure element and the case by the coupling structure, and access to secure data stored in the secure element is prevented.

公开(公告)号：US12068141B2

公开(公告)日：2024-08-20

申请号：US17969379

申请日：2022-10-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungki Lee ,  Jonggun Yoon ,  Sungkyu Choi

IPC: H01J37/32 ,  H01L21/68 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01L21/68742

Abstract: A ring assembly includes: an outer insulating ring on an upper outer periphery of a substrate stage; an edge ring on the outer insulating ring around a wafer seated on the substrate stage; and a shadow ring on the outer insulating ring and the edge ring to be movable up and down within a predetermined stroke range and to cover an edge region of the wafer. An upper surface of the edge ring is located higher than an upper surface of the wafer by a predetermined height. The shadow ring includes an annular body portion, and a recess in a bottom surface of the body portion to receive at least a portion of a protruding upper portion of the edge ring. The shadow ring is spaced apart from the outer insulating ring and the edge ring by a predetermined distance to form a flow path for gas flow therebetween.

公开(公告)号：US20210334414A1

公开(公告)日：2021-10-28

申请号：US17130989

申请日：2020-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Insub Kwak ,  Sungki Lee ,  Chunghyun Ryu

IPC: G06F21/78 ,  H01L23/00 ,  H01L23/053 ,  G06F3/06

Abstract: A storage device includes a substrate, at least one data storage element, a case, and at least one sensing pin. The substrate includes at least one security pad. The data storage element is mounted on the substrate. The case surrounds the substrate and the data storage element, and includes at least one contact structure for an electrical connection with the security pad. The sensing pin receives an electrical signal. A level of the electrical signal varies by detecting a change in a resistance according to whether the security pad is electrically connected to the contact structure. When at least a part of the case is removed, a level change of the electrical signal is detected, and a secure erase process for data stored in the data storage element is performed.