IMAGE SENSOR
    1.
    发明公开
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20230268366A1

    公开(公告)日:2023-08-24

    申请号:US18097749

    申请日:2023-01-17

    CPC classification number: H01L27/1463 H01L27/14603 H01L27/14636

    Abstract: An image sensor includes a substrate including a pixel region, the substrate extending in a first direction and a second direction intersecting the first direction, first and second photoelectric conversion regions disposed in the pixel region and adjacent to each other in a first direction, a deep device isolation pattern penetrating the substrate in a third direction perpendicular to the first and second directions, and surrounding the pixel region, the deep device isolation pattern comprising first extensions extending in the second direction between the first and second photoelectric conversion regions, the first extensions spaced apart from each other in the second direction, a plurality of first transfer gate electrodes vertically overlapping with the first photoelectric conversion region, and a plurality of second transfer gate electrodes vertically overlapping with the second photoelectric conversion region. The first photoelectric conversion region extends in the second direction under the plurality of first transfer gate electrodes.

    IMAGE SENSOR
    3.
    发明申请

    公开(公告)号:US20240421171A1

    公开(公告)日:2024-12-19

    申请号:US18818755

    申请日:2024-08-29

    Abstract: An image sensor is provided. The image sensor includes a first pixel region and a second pixel region located within a semiconductor substrate, a first isolation layer surrounding the first pixel region and the second pixel region, a second isolation layer located between the first pixel region and the second pixel region, and a microlens arranged on the first pixel region and the second pixel region. Each of the first pixel region and the second pixel region include a photoelectric conversion device. The second isolation layer includes at least one first open region that exposes a portion of an area located between the first pixel region and the second pixel region.

    IMAGE SENSOR
    4.
    发明申请
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20200279881A1

    公开(公告)日:2020-09-03

    申请号:US16592840

    申请日:2019-10-04

    Abstract: An image sensor includes a polarizer array and a depth pixel array. The polarizer array may include first to fourth unit pixels, which are arranged in a first direction and a second direction crossing each other, and may include polarization gratings respectively provided in the first to fourth unit pixels. The polarization gratings of the first to fourth unit pixels may have polarization directions different from each other. The depth pixel array may include depth pixels corresponding to the first to fourth unit pixels, respectively. Each of the depth pixels may include a photoelectric conversion device and first and second readout circuits, which are connected in common to the photoelectric conversion device.

    IMAGE SENSOR
    6.
    发明申请

    公开(公告)号:US20220359585A1

    公开(公告)日:2022-11-10

    申请号:US17675145

    申请日:2022-02-18

    Abstract: Provided is an image sensor including a semiconductor substrate having first and second surfaces disposed opposite to the first surface, a pixel separation structure disposed in the semiconductor substrate and defining and surrounding a pixel region, first and second photoelectric conversion regions disposed in the semiconductor substrate on the pixel region, a first transfer gate electrode disposed on the first surface of the semiconductor substrate and between the first photoelectric conversion region and a first floating diffusion region, a second transfer gate electrode disposed on the first surface of the semiconductor substrate and between the second photoelectric conversion region and a second floating diffusion region, a pixel gate electrode disposed on the first surface of the semiconductor substrate and overlapping one of the first and second photoelectric conversion regions, and impurity regions disposed on opposite sides of the pixel gate electrode.

    CAMERA MODULE AND OPERATING METHOD OF CAMERA MODULE

    公开(公告)号:US20220337771A1

    公开(公告)日:2022-10-20

    申请号:US17565591

    申请日:2021-12-30

    Abstract: A camera module includes pixels each including first to fourth sub-pixels, a row driver connected to the pixels through row lines, an analog-to-digital conversion circuit connected to the pixels through column lines and converting signals of the column lines into digital values, and a logic circuit. Each of the first to fourth sub-pixels includes a first region and a second region. Each of the first and second regions includes a photo detector. In response to the row driver activating signals of half or less of the photo detectors included in one pixel among the pixels, the analog-to-digital conversion circuit generates a first signal. The logic circuit generates an auto focus signal based on the first signal.

    IMAGE SENSOR INCLUDING AUTO-FOCUS PIXELS

    公开(公告)号:US20220329747A1

    公开(公告)日:2022-10-13

    申请号:US17714687

    申请日:2022-04-06

    Abstract: An image sensor includes; a pixel array including pixels arranged in a first direction and a second direction, wherein the pixels includes a first normal pixel and a first auto focus (AF) pixel adjacent in the first direction, and a second AF pixel and a second normal pixel adjacent in the first direction. Each of the first AF pixel and the second AF pixel includes at least two photodiodes, each of the first normal pixel and the second normal pixel has a quadrangular shape, a first length of the first AF pixel in the first direction is greater than a first length of the first normal pixel in the first direction, and a first length of the second AF pixel in the first direction is greater than a first length of the second normal pixel in the first direction.

    IMAGE SENSOR
    9.
    发明申请

    公开(公告)号:US20220173139A1

    公开(公告)日:2022-06-02

    申请号:US17443791

    申请日:2021-07-27

    Abstract: An image sensor includes: (1) a substrate having first and second surfaces opposing each other in a first direction and a plurality of unit pixels, (2) first and second photodiodes disposed in the substrate in each of the plurality of unit pixels and isolated from each other in a second direction perpendicular to the first direction, (3) a first device isolation film disposed between the plurality of unit pixels, and (4) a pixel internal isolation film disposed in at least one of the plurality of unit pixels. A second device isolation film overlaps at least one of the first and second photodiodes in the first direction. A pair of third device isolation films: (a) extend from the first device isolation film into the unit pixel in a third direction perpendicular to the first direction and the second direction and (b) oppose each other.

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