公开(公告)号：US20250154648A1

公开(公告)日：2025-05-15

申请号：US18791776

申请日：2024-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoo KIM ,  Daeun KIM ,  Akio SAITO ,  Tomoharu YOSHINO ,  Kazuki HARANO ,  Takashi HIGASHINO ,  Shotaro TAGUCHI ,  Yoshiki MANABE ,  Yu Jin PARK ,  Byung Seok LEE ,  Seung-min RYU ,  Gyu-Hee PARK ,  Younjoung CHO

IPC: C23C16/34 ,  C07F17/00 ,  C23C16/44 ,  C23C16/448 ,  C23C16/455

Abstract: Provided are a precursor for forming a metal thin film including a metal compound represented by Chemical Formula 1, a method for manufacturing a metal thin film using the same, and a metal thin film manufactured by the method.

公开(公告)号：US20140316164A1

公开(公告)日：2014-10-23

申请号：US14319554

申请日：2014-06-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn-Joung CHO ,  Senji WADA ,  Jung-Sik CHOI ,  Jin-Seo LEE ,  Atsushi SAKURAI ,  Kyoo-Chul CHO ,  Atsuya YOSHINAKA ,  Haruyoshi SATO ,  Junji UEYAMA ,  Tomoharu YOSHINO ,  Masako SHIMIZU

IPC: C07F3/00

CPC classification number: C07F3/003 ,  C07C249/02 ,  C07C251/08 ,  C23C16/18

Abstract: The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.

公开(公告)号：US20140309456A1

公开(公告)日：2014-10-16

申请号：US14317102

申请日：2014-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youn-Joung CHO ,  Senji WADA ,  Jung-Sik CHOI ,  Jin-Seo LEE ,  Atsushi SAKURAI ,  Kyoo-Chul CHO ,  Atsuya YOSHINAKA ,  Haruyoshi SATO ,  Junji UEYAMA ,  Tomoharu YOSHINO ,  Masako SHIMIZU

IPC: C07C251/08

CPC classification number: C07F3/003 ,  C07C249/02 ,  C07C251/08 ,  C23C16/18

Abstract: The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.

Abstract translation: 酮亚胺配体由下式1表示：其中R 1和R 2各自独立地为C 1 -C 5烷基。 金属络合物包括β-酮亚胺配体。 提供了形成β-酮亚胺配体的方法以及使用包括β-酮亚胺配体的金属络合物形成薄膜的方法。