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1.发明申请ALUMINUM PRECURSOR, METHOD OF FORMING A THIN FILM AND METHOD OF FORMING A CAPACITOR USING THE SAME 有权铝前驱体，形成薄膜的方法和使用其形成电容器的方法公开(公告)号：US20140242263A1
公开(公告)日：2014-08-28
申请号：US14176173
申请日：2014-02-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang-Chul YOUN , Atsushi SAKURAI , Masako HATASE , Youn-Joung CHO , Ji-Na KANG , Naoki YAMADA , Jung-Sik CHOI
IPC: H01G13/00
CPC classification number: H01G4/33 , H01G4/085 , H01G4/1272 , H01L27/10852 , H01L28/40
Abstract: An aluminum compound is represented by following Formula 1. In Formula 1, X is a functional group represented by following Formula 2 or Formula 3.
Abstract translation: 铝化合物由下式1表示。在式1中，X是由下式2或式3表示的官能团。
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公开(公告)号：US20140316164A1
公开(公告)日：2014-10-23
申请号：US14319554
申请日：2014-06-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youn-Joung CHO , Senji WADA , Jung-Sik CHOI , Jin-Seo LEE , Atsushi SAKURAI , Kyoo-Chul CHO , Atsuya YOSHINAKA , Haruyoshi SATO , Junji UEYAMA , Tomoharu YOSHINO , Masako SHIMIZU
IPC: C07F3/00
CPC classification number: C07F3/003 , C07C249/02 , C07C251/08 , C23C16/18
Abstract: The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.
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3.发明申请BETA-KETOIMINE LIGAND, METHOD OF PREPARING THE SAME, METAL COMPLEX COMPRISING THE SAME AND METHOD OF FORMING THIN FILM USING THE SAME 审中-公开BETA-KETOIMINE LIGAND，其制备方法，包含它们的金属复合物和使用其形成薄膜的方法公开(公告)号：US20140309456A1
公开(公告)日：2014-10-16
申请号：US14317102
申请日：2014-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youn-Joung CHO , Senji WADA , Jung-Sik CHOI , Jin-Seo LEE , Atsushi SAKURAI , Kyoo-Chul CHO , Atsuya YOSHINAKA , Haruyoshi SATO , Junji UEYAMA , Tomoharu YOSHINO , Masako SHIMIZU
IPC: C07C251/08
CPC classification number: C07F3/003 , C07C249/02 , C07C251/08 , C23C16/18
Abstract: The β-ketoimine ligand is represented by the following formula 1: wherein R1 and R2 are each independently a C1-C5 alkyl group. A metal complex compound includes the β-ketoimine ligand. A method of forming the β-ketoimine ligand and a method of forming a thin film using the metal complex compound including β-ketoimine ligand are provided.
Abstract translation: 酮亚胺配体由下式1表示：其中R 1和R 2各自独立地为C 1 -C 5烷基。 金属络合物包括β-酮亚胺配体。 提供了形成β-酮亚胺配体的方法以及使用包括β-酮亚胺配体的金属络合物形成薄膜的方法。
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