HIGH ELECTRON MOBILITY TRANSISTOR

    公开(公告)号:US20230019799A1

    公开(公告)日:2023-01-19

    申请号:US17679288

    申请日:2022-02-24

    Abstract: A high electron mobility transistor includes a channel layer; a barrier layer on the channel layer and having an energy bandgap greater than an energy bandgap of the channel layer; a gate structure on the barrier layer; a source electrode and a drain electrode spaced apart from each other on the barrier layer with the gate structure therebetween; a field plate electrically connected to the source electrode and extending above the gate structure; and a field dispersion layer in contact with the barrier layer and the drain electrode. The field dispersion layer may extend toward the gate structure.

    NITRIDE SEMICONDUCTOR DEVICE WITH FIELD EFFECT GATE

    公开(公告)号:US20230006047A1

    公开(公告)日:2023-01-05

    申请号:US17541735

    申请日:2021-12-03

    Abstract: A nitride semiconductor device having a field effect gate is disclosed. The disclosed nitride semiconductor device includes a high-resistance material layer including a Group III-V compound semiconductor, a first channel control layer on the high-resistance material layer and including a Group III-V compound semiconductor of a first conductivity type, a channel layer on the channel layer control layer and including a nitride semiconductor of a second conductivity type opposite to the first conductivity type, and a gate electrode having a contact of an ohmic contact type with the first channel control layer.

    SEMICONDUCTOR DEVICE AND POWER SWITCHING SYSTEM INCLUDING THE SAME

    公开(公告)号:US20220393029A1

    公开(公告)日:2022-12-08

    申请号:US17517987

    申请日:2021-11-03

    Abstract: A semiconductor device includes: a semiconductor substrate including a first surface and a second surface facing each other and including a first semiconductor material; a plurality of fin structures upwardly extending on the first surface of the semiconductor substrate, spaced apart from each other by a plurality of trenches, and including the first semiconductor material as the semiconductor substrate; an insulating layer on the first surface of the semiconductor substrate filling at least a portion of the plurality of trenches; a gate electrode layer between the plurality of fin structures and surrounded by the insulating layer; a first conductive layer covering the plurality of fin structures; a second conductive layer on the second surface of the semiconductor substrate; and a shield layer between the gate electrode layer and the semiconductor substrate, surrounded by the insulating layer, and electrically connected to the second conductive layer.

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