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公开(公告)号:US20240113184A1
公开(公告)日:2024-04-04
申请号:US18193859
申请日:2023-03-31
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhyuk PARK , Jaejoon OH , Sunkyu HWANG , Boram KIM , Jongseob KIM , Joonyong KIM , Injun HWANG
IPC: H01L29/423 , H01L29/20 , H01L29/40 , H01L29/66 , H01L29/778
CPC classification number: H01L29/42316 , H01L29/2003 , H01L29/401 , H01L29/66462 , H01L29/7786
Abstract: A semiconductor device may include a barrier layer on a channel layer, a gate electrode on the barrier layer, a gate semiconductor layer between the barrier layer and the gate electrode, and a source and a drain spaced apart from each other on the channel layer. The barrier layer may have a greater energy band gap than the channel layer. The gate semiconductor layer may include a first surface contacting the barrier layer and a second surface contacting the gate electrode, and a sidewall connecting the first surface with the second surface. An area of the second surface of the gate semiconductor layer may be narrower than an area of the first surface. The sidewall of the gate semiconductor layer may include a plurality of surfaces having different slopes.
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公开(公告)号:US20240096944A1
公开(公告)日:2024-03-21
申请号:US18133276
申请日:2023-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Joonyong KIM , Sunkyu HWANG , Boram KIM , Jongseob KIM , Junhyuk PARK , Jaejoon OH , Injun HWANG
IPC: H01L29/06 , H01L21/3065 , H01L23/473 , H01L29/66 , H10N39/00
CPC classification number: H01L29/0657 , H01L21/3065 , H01L23/473 , H01L29/66462 , H10N39/00 , H01L29/7786
Abstract: Provided are a power device and a manufacturing method thereof. A power device includes a compound semiconductor layer epitaxially grown on a substrate, a gate formed on the compound semiconductor layer, a source and a drain provided on either side of the gate, a passivation layer provided to cover the source, drain, and gate, and a cooling space region provided to form a cooling path inside the substrate. The cooling space region may be formed to a predetermined depth from the surface of the substrate and include an enlargement region having a width increasing according to a depth from the surface of the substrate. The width of an inlet of the cooling space region is less than a maximum width of the enlargement region, and the passivation layer and the compound semiconductor layer are provided to open the cooling space region.
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公开(公告)号:US20220416070A1
公开(公告)日:2022-12-29
申请号:US17537989
申请日:2021-11-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junhyuk PARK , Sunkyu HWANG , Jongseob KIM , Joonyong KIM , Woochul JEON
IPC: H01L29/778 , H01L23/29 , H01L23/31 , H01L29/20 , H01L29/205 , H01L21/02 , H01L29/66
Abstract: The present disclosure provides a high electron mobility transistor including a channel layer; a barrier layer on the channel layer and configured to induce formation of a 2-dimensional electron gas (2DEG) to the channel layer; a p-type semiconductor layer on the barrier layer; a first passivation layer on the barrier layer and including a quaternary material of Al, Ga, O, and N; a gate electrode on the p-type semiconductor layer; and a source electrode and a drain electrode provided on both sides of the barrier layer and separated from the gate electrode.
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公开(公告)号:US20210399120A1
公开(公告)日:2021-12-23
申请号:US17098896
申请日:2020-11-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunkyu HWANG , Joonyong KIM , Jongseob KIM , Junhyuk PARK , Boram KIM , Younghwan PARK , Dongchul SHIN , Jaejoon OH , Soogine CHONG , Injun HWANG
IPC: H01L29/778 , H01L29/66
Abstract: Provided is a high electron mobility transistor including: a channel layer comprising a 2-dimensional electron gas (2DEG); a barrier layer on the channel layer and comprising first regions and a second region, the first regions configured to induce the 2DEG of a first density in portions of the channel layer and the second region configured to induce the 2DEG of a second density different from the first density in other portions of the channel layer; source and drain electrodes on the barrier layer; a depletion formation layer formed on the barrier layer between the source and drain electrodes to form a depletion region in the 2DEG; and a gate electrode on the barrier layer. The first regions may include a first edge region and a second edge region corresponding to both ends of a surface of the gate electrode facing the channel layer.
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公开(公告)号:US20210118814A1
公开(公告)日:2021-04-22
申请号:US16868745
申请日:2020-05-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Younghwan PARK , Jongseob KIM , Joonyong KIM , Junhyuk PARK , Dongchul SHIN , Jaejoon OH , Soogine CHONG , Sunkyu HWANG , Injun HWANG
IPC: H01L23/00 , H01L29/20 , H01L29/205 , H01L29/778 , H01L29/15
Abstract: A semiconductor thin film structure may include a substrate, a buffer layer on the substrate, and a semiconductor layer on the buffer layer, such that the buffer layer is between the semiconductor layer and the substrate. The buffer layer may include a plurality of unit layers. Each unit layer of the plurality of unit layers may include a first layer having first bandgap energy and a first thickness, a second layer having second bandgap energy and a second thickness, and a third layer having third bandgap energy and a third thickness. One layer having a lowest bandgap energy of the first, second, and third layers of the unit layer may be between another two layers of the first, second, and third layers of the unit layer.
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6.
公开(公告)号:US20240345682A1
公开(公告)日:2024-10-17
申请号:US18634547
申请日:2024-04-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyungsoon KIM , Junhyuk PARK , Hyunwoo LEE
CPC classification number: G06F3/0418 , G06F3/046 , G06F2203/04106
Abstract: An electronic device includes memory storing instructions, a radar configured to transmit an electromagnetic signal and receive a radar signal which is a reflected signal of the electromagnetic signal, the reflected signal being reflected from at least one target object, a touch pad configured to detect a touch of a user based on a designated touch threshold value, and at least one processor operatively coupled with the memory, the radar, and the touch pad. The instructions may, when executed by the at least one processor, cause the electronic device to: obtain the radar signal received by the radar; identify, based on the radar signal, a surrounding environment of the electronic device, and adjust the touch threshold value based on the surrounding environment.
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公开(公告)号:US20240089471A1
公开(公告)日:2024-03-14
申请号:US18321278
申请日:2023-05-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Keun Joo PARK , Junhyuk PARK , Jiwon IM , Junseok KIM
IPC: H04N19/182 , H04N19/126 , H04N19/132 , H04N19/186
CPC classification number: H04N19/182 , H04N19/126 , H04N19/132 , H04N19/186
Abstract: An operation method of an image signal processing device includes receiving a raw pixel code from an external image sensor device including an image pixel, generating a non-linear pixel code by performing non-linear mapping on the raw pixel code, and outputting a downsized pixel code obtained by performing a masking operation on bit positions including a first bit position corresponding to a most significant bit of the non-linear pixel code and a second bit position corresponding to a least significant bit of the non-linear pixel code. An amplitude of the raw pixel code is linear to illuminance of a light incident onto the image pixel, an amplitude of the non-linear pixel code is non-linear to the amplitude of the raw pixel code, and the non-linear pixel code has a first code length, and the downsized pixel code has a second code length smaller than the first code length.
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公开(公告)号:US20220320327A1
公开(公告)日:2022-10-06
申请号:US17398407
申请日:2021-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Joonyong KIM , Sunkyu HWANG , Jongseob KIM , Junhyuk PARK
IPC: H01L29/778 , H01L29/40 , H01L29/66 , H01L29/20
Abstract: Provided are a power device and a method of manufacturing the same. The power device may include a channel layer; a source and a drain at respective sides of the channel layer; a gate on the channel layer between the source and the drain; a passivation layer covering the source, the drain, and the gate; and a plurality of field plates in the passivation layer. The plurality of field plates may have different thicknesses. The plurality of field plates may have different widths, different pattern shapes, or both different widths and different pattern shapes.
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公开(公告)号:US20220013659A1
公开(公告)日:2022-01-13
申请号:US17082478
申请日:2020-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Injun HWANG , Jaejoon OH , Soogine CHONG , Jongseob KIM , Joonyong KIM , Junhyuk PARK , Sunkyu HWANG
IPC: H01L29/778 , H01L29/20 , H01L29/40 , H01L29/66
Abstract: A high electron mobility transistor (HEMT) includes a channel layer comprising a group III-V compound semiconductor; a barrier layer comprising the group III-V compound semiconductor on the channel layer; a gate electrode on the barrier layer; a source electrode over gate electrode; a drain electrode spaced apart from the source electrode; and a metal wiring layer. A same layer of the metal wiring layer includes a gate wiring connected to the gate electrode, a source field plate connected to the source electrode, and a drain field plate connected to the drain electrode.
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10.
公开(公告)号:US20250024173A1
公开(公告)日:2025-01-16
申请号:US18418992
申请日:2024-01-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junseok KIM , Jiwon IM , Junhyuk PARK
IPC: H04N25/77 , H04N25/709
Abstract: Disclosed is a dynamic vision sensor. The dynamic vision sensor includes a photodiode configured to generate a first photodiode current in response to a change in light due to a movement of an object, a first transistor; a first node connected to the photodiode and the first transistor; a second node connected to the first transistor and being configured to receive a first voltage and receive a second voltage, a ground, a second transistor connected to the first node and the ground, a third node connected to the first transistor and the second transistor, and a current source connected to the third node, wherein the first voltage has a first level and the second voltage has a second level different from the first level.
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