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公开(公告)号：US20250151220A1
公开(公告)日：2025-05-08
申请号：US19014970
申请日：2025-01-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngkyong JO , Wooktae KIM , Taehyeong RYU , Jungkyu PARK , Youngmin SEO , Bora LEE , Sangbong LEE , Wonho LEE , Jongsu LEE
Abstract: An electronic device is provided. The electronic device includes a foldable housing and a flexible display. The foldable housing may provide a front surface of the electronic device and a rear surface of the electronic device. The flexible display may be located in an inner space of the foldable housing. The flexible display may be combined with a front cover of the foldable housing providing the front surface. The front cover may include a pattern in which a plurality of openings corresponding to a folding portion of the foldable housing or a plurality of recesses provided in a surface facing the flexible display are periodically provided. A plurality of sub-pixels emitting light of a same wavelength in the flexible display may be arranged in a same direction as a direction in which the plurality of openings or the plurality of recesses are periodically arranged.
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公开(公告)号：US20210050336A1
公开(公告)日：2021-02-18
申请号：US16992004
申请日：2020-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jamyeong KOO , Sungyong MIN , Byunghoon LEE , Changjoon LEE , Changkyu CHUNG , Youngkyong JO
IPC: H01L25/16 , H01L23/00 , H01L25/075
Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.
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Patent Agency Ranking
公开(公告)号：US20230156947A1
公开(公告)日：2023-05-18
申请号：US18155355
申请日：2023-01-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngkyong JO , Wooktae KIM , Taehyeong RYU , Jungkyu PARK , Youngmin SEO , Bora LEE , Sangbong LEE , Wonho LEE , Jongsu LEE
CPC classification number: H05K5/03 , B32B3/30 , B32B3/266 , B32B7/12 , B32B17/10005 , B32B27/08 , B32B2307/558 , B32B2307/732 , B32B2457/20
Abstract: An electronic device is provided. The electronic device includes a foldable housing and a flexible display. The foldable housing may provide a front surface of the electronic device and a rear surface of the electronic device. The flexible display may be located in an inner space of the foldable housing. The flexible display may be combined with a front cover of the foldable housing providing the front surface. The front cover may include a pattern in which a plurality of openings corresponding to a folding portion of the foldable housing or a plurality of recesses provided in a surface facing the flexible display are periodically provided. A plurality of sub-pixels emitting light of a same wavelength in the flexible display may be arranged in a same direction as a direction in which the plurality of openings or the plurality of recesses are periodically arranged.
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公开(公告)号：US20220103672A1
公开(公告)日：2022-03-31
申请号：US17496652
申请日：2021-10-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinho JUNG , Youngkyong JO , Kyongrok KANG , Wooktae KIM , Jungkyu PARK , Gyuhyun BYUN , Jungwon BYUN , Bora LEE
Abstract: According to various embodiments, an electronic device may include a first housing, a second housing foldably connected to the first housing through a hinge device, and a flexible display including a first portion facing the first housing, a second portion facing the second housing, and a bendable third portion connecting the first portion and the second portion and facing the hinge device. The flexible display may include a window layer including a first region facing the first portion, a second region facing the second portion, and a third region facing the third portion and configured to be bendable, a display panel disposed under the window layer, and a subsidiary material layer disposed under the display panel. The window layer may include a glass layer including a plurality of first openings formed at specified intervals and a filling member filled in the plurality of first openings. Other embodiments may be possible.
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公开(公告)号：US20240251518A1
公开(公告)日：2024-07-25
申请号：US18624451
申请日：2024-04-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngkyong JO , Seokki KIM , Bora LEE , Sangbong LEE , Jongsu LEE , Seongwoo CHOI
CPC classification number: H05K5/03 , H05K5/0226
Abstract: A foldable electronic device is provided. The foldable electronic device includes a foldable housing including multiple housings and at least one hinge configured to rotatably couple the multiple housings, the folding housing being folded around the hinge, and a flexible display disposed on the foldable housing so as to be folded according to a folding operation of the foldable housing, wherein the flexible display includes a panel layer configured to display image information, a glass layer positioned above the panel layer with reference to a direction in which the image information is displayed, the glass layer being folded when the flexible display is folded, a folding region positioned on a folding part of the glass layer, the folding region including multiple through-holes formed to penetrate the glass layer in the thickness direction and arranged regularly on a surface of the glass layer, and a rib, which is a region between the multiple through-holes adjacent to each other, a flexible polymer region including a transparent and elastic flexible polymer material positioned in the through-holes, and a hard coating layer positioned on upper surfaces of the glass layer and the flexible polymer region, the hard coating layer having a higher elastic modulus than the transparent and elastic flexible polymer material.
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公开(公告)号：US20210265327A1
公开(公告)日：2021-08-26
申请号：US17253645
申请日：2019-06-24
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jamyeong KOO , Youngkyong JO , Byunghoon LEE
Abstract: A micro-LED display and a method for manufacturing same are disclosed. The disclosed micro-LED display may comprise: a circuit board; at least one first electrode formed on the circuit board; at least one micro-LED chip bonded onto the first electrode; a second electrode formed on the micro-LED chip; a bonding structure formed by heating the first electrode and the second electrode through laser irradiation; and at least one composite resin part supporting the bonding structure.
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公开(公告)号：US20200235128A1
公开(公告)日：2020-07-23
申请号：US16749344
申请日：2020-01-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangmin SHIN , Jinho KIM , Youngki JUNG , Youngkyong JO
IPC: H01L27/12 , H01L25/13 , H01L21/768
Abstract: A display module, including a glass substrate on which a thin film transistor (TFT) is formed; and a sub-pixel disposed on the TFT, wherein the TFT includes: a first electrode; a second electrode spaced apart from the first electrode; a source pad spaced part from the second electrode in a perpendicular direction and electrically connected to the second electrode; and a gate pad disposed below the source pad, wherein the sub-pixel includes a light emitting diode (LED), wherein the LED is connected to the first electrode and the second electrode, and wherein the source pad is extended toward the second electrode beyond the first electrode facing a space between the first electrode and the second electrode in an upward direction, and facing a portion of the gate pad in a downward direction.
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