公开(公告)号：US20230223388A1

公开(公告)日：2023-07-13

申请号：US18121939

申请日：2023-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Tackmo LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L25/0753

Abstract: A display module including a plurality of pixels, according to an embodiment, may include: a first substrate: a plurality of inorganic light-emitting elements disposed on the upper surface of the first substrate; a plurality of micro pixel controllers disposed on the lower surface of the first substrate; and a driver IC which transmits driving signals to the plurality of micro pixel controllers, wherein each of the plurality of pixels includes two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and each of the plurality of micro pixel controllers controls two or more pixels among the plurality of pixels.

公开(公告)号：US20250081688A1

公开(公告)日：2025-03-06

申请号：US18951127

申请日：2024-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mingyu LEE ,  Eunhye KIM ,  Sangmoo PARK ,  Jamyeong KOO ,  Sera KWON ,  Byunghoon LEE ,  Yoonsuk LEE ,  Changkyu CHUNG

IPC: H01L33/56 ,  H01L25/075 ,  H01L33/62

Abstract: A display module includes a plurality of inorganic light-emitting elements, a substrate including a mounting surface on which the plurality of inorganic light-emitting elements are mounted, and a non-conductive film (NCF) disposed on the substrate and configured to bond the plurality of inorganic light-emitting elements to the substrate. The NCF may have a black-based color.

公开(公告)号：US20240255563A1

公开(公告)日：2024-08-01

申请号：US18602717

申请日：2024-03-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Changkyu CHUNG ,  Kyungwoon JANG ,  Daeseok HWANG

IPC: G01R31/26

CPC classification number: G01R31/2635

Abstract: An electroluminescence inspection apparatus includes a first substrate, and electrode members arranged at a first surface of the first substrate, and electrically contacted respectively with a chip electrode pad of light emitting diodes arranged at a second substrate based on performing an electroluminescence inspection, wherein an electrode member includes contact protrusions configured to be elastically contacted at a chip electrode member of the light emitting diode based on the first substrate is pressed by the second substrate.

公开(公告)号：US20230253388A1

公开(公告)日：2023-08-10

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Gyun HEO ,  Tackmo LEE ,  Kyungwoon JANG ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L25/167 ,  H01L33/62 ,  G09G3/32 ,  G09G2300/026 ,  G09G2300/0842 ,  G09G2300/0426 ,  G09G2300/0452

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

公开(公告)号：US20240203910A1

公开(公告)日：2024-06-20

申请号：US18590302

申请日：2024-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tackmo LEE ,  Changkyu CHUNG ,  Gunwoo KIM ,  Soonmin HONG

IPC: H01L23/60 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/60 ,  H01L23/3192 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L24/33 ,  H01L2224/29028 ,  H01L2224/32145 ,  H01L2224/32175 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2924/12041 ,  H01L2924/1426

Abstract: A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal cover covering the rear surface and a first area of the side surface, the first area extending from the rear surface; and a side member positioned below the outer area from the mounting surface and adhered to a second area of the side surface, the second area extending from the mounting surface, and at least a portion of the metal cover. The metal cover includes a rear portion covering the rear surface, a side portion covering the first area of the side surface, and a bent portion bent between the rear portion and the side portion.

公开(公告)号：US20230290919A1

公开(公告)日：2023-09-14

申请号：US18139691

申请日：2023-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Sungyong Min ,  Kyungwoon Jang ,  Kwangrae Jo

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

Abstract: A display module includes a substrate, a plurality of substrate electrode pads provided on the substrate, and a plurality of micro light-emitting diodes (LEDs) connected to the plurality of substrate electrode pads, where each of the plurality of substrate electrode pads includes a first region in which a plurality of contact protrusions are formed, and a second region configured to be connected with a repair micro LED.

公开(公告)号：US20210050336A1

公开(公告)日：2021-02-18

申请号：US16992004

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong KOO ,  Sungyong MIN ,  Byunghoon LEE ,  Changjoon LEE ,  Changkyu CHUNG ,  Youngkyong JO

IPC: H01L25/16 ,  H01L23/00 ,  H01L25/075

Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

公开(公告)号：US20220415873A1

公开(公告)日：2022-12-29

申请号：US17902611

申请日：2022-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changsun KANG ,  Huigyeong AHN ,  Kyungwoon JANG ,  Sangtae HAN ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32 ,  G09G3/20

Abstract: A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.

公开(公告)号：US20220149112A1

公开(公告)日：2022-05-12

申请号：US17524421

申请日：2021-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daesuck HWANG ,  Kyungwoon JANG ,  Changkyu CHUNG ,  Gyun HEO ,  Soonmin HONG

IPC: H01L27/15 ,  H01L33/00

Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

公开(公告)号：US20200152721A1

公开(公告)日：2020-05-14

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Youngjun MOON ,  Kwangrae JO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L27/32 ,  H05B33/10 ,  H05B33/08

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.