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公开(公告)号:US10757846B2
公开(公告)日:2020-08-25
申请号:US16535528
申请日:2019-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haejin Lee , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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公开(公告)号:US20240250109A1
公开(公告)日:2024-07-25
申请号:US18460802
申请日:2023-09-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Juntaek Lee , Yunjeong Park , Sanghyeon Lee , Seulrim Lee , Jungsup Hong
IPC: H01L27/146 , H01L21/66
CPC classification number: H01L27/14698 , H01L22/20
Abstract: A method for reducing white spots of the image sensor may include: manufacturing an image sensor; testing the manufactured image sensor to select an image sensor without defects; and heat-treating the selected image sensor without defects.
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公开(公告)号:US11503748B2
公开(公告)日:2022-11-15
申请号:US17166248
申请日:2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: Haejin Lee , Dongku Kang , Jihong Kim , Min Park , Yunjeong Park , Kyuhwan Lee , Jinhwan Jung , Ahreum Hwang , Kyungha Koo
Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.
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公开(公告)号:US20200053919A1
公开(公告)日:2020-02-13
申请号:US16535528
申请日:2019-08-08
Applicant: Samsung Electronics Co., Ltd
Inventor: Haejin LEE , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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公开(公告)号:US11895767B2
公开(公告)日:2024-02-06
申请号:US17286007
申请日:2019-10-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kyungha Koo , Hongki Moon , Chihwan Jeong , Kuntak Kim , Yunjeong Park , Seungjoo Lee , Haejin Lee , Seyoung Jang
CPC classification number: H05K1/0203 , H05K1/144 , H05K1/18 , H05K2201/047
Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.
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公开(公告)号:US11632881B2
公开(公告)日:2023-04-18
申请号:US16952595
申请日:2020-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chihwan Jeong , Kyungha Koo , Jihong Kim , Dongku Kang , Kuntak Kim , Yunjeong Park , Kyuhwan Lee , Haejin Lee , Seyoung Jang , Hyuntae Jang
Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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