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公开(公告)号：US12278420B2
公开(公告)日：2025-04-15
申请号：US17168321
申请日：2021-02-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Younghoon Kim , Juhyun Park , Younggirl Yun , Taewook Ham , Haejin Lee , Jooho Jang
Abstract: According to certain embodiments, an electronic device comprises: a window forming at least a portion of a front surface of the electronic device; a cover forming at least a portion of a rear surface of the electronic device; a bracket disposed between the window and the cover; a printed circuit board supported by the bracket and disposed between the window and the cover; a shield can disposed on the printed circuit board covering a designated area of the printed circuit board; at least one communication processor disposed on the printed circuit board; and a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board, wherein the mmWave antenna module is disposed on the shield can and configured to transfer heat to the shield can.
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公开(公告)号：US11098959B2
公开(公告)日：2021-08-24
申请号：US17094293
申请日：2020-11-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US10798849B2
公开(公告)日：2020-10-06
申请号：US16515275
申请日：2019-07-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
IPC: H05K7/20 , F28D15/02 , H01L23/427 , G06F1/20 , H05K9/00
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US10757846B2
公开(公告)日：2020-08-25
申请号：US16535528
申请日：2019-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Min Park , Jungje Bang , Kyungha Koo , Yunjeong Park
Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
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公开(公告)号：US11895767B2
公开(公告)日：2024-02-06
申请号：US17286007
申请日：2019-10-15
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungha Koo , Hongki Moon , Chihwan Jeong , Kuntak Kim , Yunjeong Park , Seungjoo Lee , Haejin Lee , Seyoung Jang
CPC classification number: H05K1/0203 , H05K1/144 , H05K1/18 , H05K2201/047
Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.
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Patent Agency Ranking
公开(公告)号：US11632881B2
公开(公告)日：2023-04-18
申请号：US16952595
申请日：2020-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chihwan Jeong , Kyungha Koo , Jihong Kim , Dongku Kang , Kuntak Kim , Yunjeong Park , Kyuhwan Lee , Haejin Lee , Seyoung Jang , Hyuntae Jang
Abstract: The disclosure relates to a wireless charging device including a cooling fan, and the wireless charging device according to an embodiment of the disclosure includes: a housing including a holding portion configured to hold an external electronic device; a first bracket positioned in the holding portion; a conductive coil disposed in the first bracket; a second bracket positioned in the holding portion and including a penetrating hole; a first cooling fan positioned in the penetrating hole; a second cooling fan positioned in the penetrating hole and spaced apart from the first cooling fan; and a partition formed in the penetrating hole to isolate the first cooling fan and the second cooling fan from each other, the penetrating hole being divided into a first area having the first cooling fan disposed therein and a second area having the second cooling fan positioned therein, at least one protrusion having a volute shape formed on at least a portion of the second bracket or at least a portion of the partition, a first opening formed on at least an area of the first bracket to allow air cooled by the first cooling fan and/or the second cooling fan to move to the holding portion, and a second opening formed on at least an area of the holding portion to allow the air transmitted from the first opening to move outside the wireless charging device.
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公开(公告)号：US11978950B2
公开(公告)日：2024-05-07
申请号：US17457989
申请日：2021-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Min Park , Jinhwan Jung
Abstract: According to various embodiments, an electronic device includes: a housing including a conductive part; an antenna module, including a substrate including a first substrate surface, a second substrate surface facing a direction opposite a direction of the first substrate surface, and a substrate side surrounding a space between the first substrate surface and the second substrate surface, at least one antenna element disposed in the substrate, wireless communication circuitry disposed in the substrate and configured to transmit and/or receive a radio signal in the direction toward which the first substrate surface is directed through the at least one antenna element, a protection member disposed on the second substrate surface, and a conductive shield layer disposed on at least an external surface of the protection member, as an antenna module disposed in an internal space of the housing; a conductive member disposed in at least a part of the conductive part and having at least a partial area thereof facing at least a part of the conductive shield layer; and a noise induction layer disposed between the antenna module and the conductive member to form a capacitor structure having a specified capacitance value between the conductive shield layer and the conductive member. Noise induced from the antenna module may be induced toward the conductive part through the capacitor structure.
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公开(公告)号：US11555657B2
公开(公告)日：2023-01-17
申请号：US17375626
申请日：2021-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Kyungha Koo , Chunghyo Jung , Se-Young Jang , Jungje Bang , Jaeheung Ye , Chi-Hyun Cho
Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.
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公开(公告)号：US11503748B2
公开(公告)日：2022-11-15
申请号：US17166248
申请日：2021-02-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haejin Lee , Dongku Kang , Jihong Kim , Min Park , Yunjeong Park , Kyuhwan Lee , Jinhwan Jung , Ahreum Hwang , Kyungha Koo
Abstract: A portable communication device is provided. A portable communication device includes a first nanofiber member having a first density, a second nanofiber member attached to the first nanofiber member and having a second density lower than the first density, a heat transfer member positioned on or above the second nanofiber member, and a conductive material coated on at least a portion of the first nanofiber member and the second nanofiber member. At least some of the conductive material may penetrate into the first nanofiber member or the second nanofiber member. Various other embodiments may be possible.
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公开(公告)号：US12238911B2
公开(公告)日：2025-02-25
申请号：US17986242
申请日：2022-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Haejin Lee , Min Park , Kyuhwan Lee
Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.
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