-
公开(公告)号：US11894603B2
公开(公告)日：2024-02-06
申请号：US17418588
申请日：2019-12-31
Inventor： Yeonwoo Kim , Wonbin Hong , Wonpyo Kwon , Sehyun Park , Sumin Yun
CPC classification number: H01Q1/243 , H01Q1/24 , H01Q9/04 , H01Q9/0407 , H01Q9/06 , H01Q9/065 , H01Q9/16
Abstract: An electronic device is disclosed. The electronic device comprises: a first plate including a first planar region facing a first direction; a second plate comprising a second planar region facing a second direction opposite to the first direction; a housing including a side member surrounding an inner space between the first plate and the second plate; a display disposed between the first plate and the second plate and viewed through the first plate; and an antenna module disposed between the display and the second plate and configured to emit electromagnetic waves to the outside of the housing. The antenna module comprises: an antenna substrate including a first surface facing the first plate, a second surface facing the second plate, and a third surface facing the inner surface of the side member; and a wireless communication circuit disposed on the first surface of the antenna substrate. The antenna substrate comprises: a first antenna adjacent to the first surface or formed on the first surface; a second antenna adjacent to the second surface or formed on the second surface; and a third antenna formed between the first antenna and the second antenna. The first antenna is formed at a first distance from the third surface, the second antenna is formed at a second distance from the third surface, and the third antenna may be formed at a third distance that is greater than the first distance and the second distance from the third surface. Various other embodiments inferred from the present specification are also possible.
-
公开(公告)号：US11417954B2
公开(公告)日：2022-08-16
申请号：US17262087
申请日：2019-07-31
Inventor： Yeonwoo Kim , Wonbin Hong , Sehyun Park , Junho Park , Sumin Yun
Abstract: An electronic device according to an embodiment of the present invention may include a housing and an antenna module disposed on one surface of the housing, wherein the antenna module may include a printed circuit board including a first layer facing the one surface of the housing, a second layer facing the first layer, and at least one ground layer disposed between the first layer and the second layer, a first antenna array disposed on the first layer, a second antenna array disposed on the second layer and at least partially overlapping the first antenna array when viewed from the one surface of the housing, and a communication circuit (radio frequency integrated circuit (RFIC)) electrically connected to the first antenna array and the second antenna array and feeding the first antenna array and the second antenna array, wherein the communication circuit may be configured to receive a first signal from an external device via at least one of the first antenna array or the second antenna array, change a phase of at least a portion of the first antenna array and the second antenna array based on the first signal, and transmit/receive a second signal in a direction of a beam formed by the changed phase. Other various embodiments could be derived from the description.
-
公开(公告)号：US12009577B2
公开(公告)日：2024-06-11
申请号：US17955770
申请日：2022-09-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonheung Kwon , Sumin Yun , Hosaeng Kim , Hyunjeong Lee , Hyungjoo Lee
CPC classification number: H01Q1/243 , H01Q1/48 , H01Q5/25 , H01Q5/307 , H01Q9/0407
Abstract: An electronic device includes a housing providing a front surface and a rear surface, an antenna including a printed circuit board within the housing and including a first surface facing the front surface and a second surface facing the rear surface. The printed circuit board includes a first conductive layer including a first antenna element and a second antenna element that do not overlap each other when viewed from above the first surface, a second conductive layer operating as a ground plane, and a dielectric between the first and second conductive layers. A conductive pattern is located between the front surface and the second surface when the first surface faces the rear surface and is located between the rear surface and the second surface when the first surface faces the front surface. The conductive pattern overlaps a part of the second conductive layer when viewed from above the first surface.
-
公开(公告)号：US11217878B2
公开(公告)日：2022-01-04
申请号：US16788822
申请日：2020-02-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Myunghun Jeong , Jaehoon Jo , Dongyeon Kim , Hosaeng Kim , Seongjin Park , Sumin Yun , Woomin Jang , Jehun Jong , Jaebong Chun
Abstract: An electronic device is provided. The electronic device includes a housing and an antenna structure. The housing includes a front plate, a rear plate, and a lateral member surrounding a space between the front and rear plates. The antenna structure is disposed in the space includes a printed circuit board (PCB) disposed in the space and includes a ground layer at least in part. The antenna structure further includes at least one conductive patch disposed on the PCB in a second direction and configured to transmit and/or receive first and second signals having a frequency between about 3 GHz and about 100 GHz. The conductive patch includes a first feeder and a second feeder. The first feeder is disposed on a first virtual line passing through a center of the conductive patch and forming a first angle with respect to a virtual axis passing through the center and perpendicular to the second direction, and configured to transmit and/or receive the first signal having a first polarization. The second feeder is disposed on a second virtual line passing through the center and forming a second angle with respect to the virtual axis, and configured to transmit and/or receive the second signal having a second polarization perpendicular to the first polarization. A sum of the first and second angles is substantially 90 degrees.
-
公开(公告)号：US20210328348A1
公开(公告)日：2021-10-21
申请号：US17364103
申请日：2021-06-30
Inventor： Yeonwoo Kim , Wonbin Hong , Junho Park , Jaehyun Choi , Sehyun Park , Sumin Yun
Abstract: An electronic device is provided. The electronic device includes a housing. The housing includes a first plate that is directed outward in a first direction, a second plate that is directed outward in a second direction opposite to the first direction, and a side member that surrounds a space between the first and second plates. The electronic device further includes a first antenna structure located in the space, wherein the first antenna structure includes a first conductive structure including a first conductive layer, which is substantially parallel to the second plate and includes a first edge extending in a third direction perpendicular to the first direction and a first notch portion disposed at the first edge, and a first conductive wall, which is substantially perpendicular to the first conductive layer and includes a second notch portion extending from the first edge and connected to the first notch portion. The electronic device further includes a second conductive structure located in the first notch portion and electrically isolated from the first conductive structure; and a third conductive structure located between the first conductive layer and the first plate and electrically isolated from the first conductive structure and the second conductive structure. The third conductive structure includes a second conductive layer facing the first conductive layer and having a quadrilateral shape, the second conductive layer including a second edge extending parallel to the first edge, a third edge extending perpendicular to the second edge, a fourth edge extending parallel to the third edge, and a fifth edge extending parallel to the second edge, wherein a distance to the fifth edge from the first conductive wall is shorter than a distance to the second edge from the first conductive wall, a second conductive wall facing the first conductive wall and extending from the second edge, a third conductive wall connected to the third edge and the second conductive wall and perpendicular to the second conductive layer and the second conductive wall, and a fourth conductive wall connected to the fourth edge and the second conductive wall and perpendicular to the second conductive layer and the second conductive wall. The electronic device further includes a wireless communication circuit electrically connected to the second conductive structure and configured to transmit or receive a signal having a frequency of 3 GHz to 100 GHz.
-
Patent Agency Ranking
公开(公告)号：US11018415B2
公开(公告)日：2021-05-25
申请号：US17082520
申请日：2020-10-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyungbin Kim , Chongo Yoon , Sumin Yun , Hyunseock Roh , Gyubok Park , Jinwoo Jung , Jaebong Chun , Hochul Hwang
Abstract: An electronic device is provided. The electronic device includes a housing structure that includes a ceramic portion including a ceramic material, and a polymer portion formed on an inner surface of the ceramic portion and including a polymer material, and an antenna structure that is disposed within the housing structure and radiates a radio frequency (RF) signal to an outside of the housing structure. The housing structure includes a first portion including at least a portion of a region through which the RF signal passes, and a second portion formed around the first portion. In the first portion, a ratio of a thickness of the polymer portion to an entire thickness of the first portion is a first ratio. In the second portion, a ratio of a thickness of the polymer portion to an entire thickness of the second portion is a second ratio.
-
公开(公告)号：US12212063B2
公开(公告)日：2025-01-28
申请号：US18311500
申请日：2023-05-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin Park , Dongyeon Kim , Hosaeng Kim , Sumin Yun , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
Abstract: An electronic device is provided. The electronic devices includes a housing at least partially including a conductive portion, an antenna structure including a printed circuit board including a plurality of insulating layers, at least one first conductive patch including a first feeding point, and a second feeding point, and at least one second conductive patch including a third feeding point, and a fourth feeding point, and an antenna module including a wireless communication circuit configured to transmit or receive a first signal through the at least one first conductive patch and to transmit or receive a second signal of a second frequency band through the at least one second conductive patch.
-
公开(公告)号：US11901631B2
公开(公告)日：2024-02-13
申请号：US17532070
申请日：2021-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyihyun Jang , Sumin Yun , Kyunggu Kim , Kyungmoon Seol , Jinwoo Jung , Jaebong Chun
IPC: H01Q1/24 , H01Q21/06 , H01Q1/22 , H01Q9/04 , H01Q9/16 , H05K5/00 , H01Q1/52 , H05K9/00 , H01Q15/14
CPC classification number: H01Q21/06 , H01Q1/2283 , H01Q1/24 , H01Q1/526 , H01Q9/0407 , H01Q9/16 , H01Q15/14 , H05K5/0017 , H05K9/0024
Abstract: An electronic device according to various embodiments may include: a column-shaped housing including a processor and a communication module comprising communication circuitry disposed therein; a rollable display wound on a column face of the housing, wherein a printed circuit board is disposed on the housing; an array antenna mounted or embedded on the printed circuit board as a module; and a director unit including at least one director comprising a conductive material corresponding to a beam being formed by the array antenna and disposed on at least a part of the rollable display in a state in which the rollable display is wound.
-
公开(公告)号：US11824260B2
公开(公告)日：2023-11-21
申请号：US16972111
申请日：2019-06-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sewoong Kim , Chaeup Yoo , Sumin Yun , Woosuk Kang , Inyoung Lee
CPC classification number: H01Q1/38 , H01Q1/24 , H05K1/02 , H05K1/0243 , H05K5/00 , H05K5/0017 , H05K5/0086 , H05K7/14 , H05K7/1427 , H05K2201/10037
Abstract: According to an embodiment, an electronic device may include a display including a first conductive plate, a printed circuit board interposed between a rear surface of housing and the display and including a second conductive plate, a first conductive pattern and a second conductive pattern that are interposed between the display and the printed circuit board, a wireless communication circuit electrically connected to the first conductive pattern and transmitting or receiving an RF signal of a first frequency or an RF signal of a second frequency, and at least one processor electrically connected to the wireless communication circuit. Besides, various embodiments as understood from the specification are also possible.
-
公开(公告)号：US11705619B2
公开(公告)日：2023-07-18
申请号：US17094916
申请日：2020-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongjin Park , Dongyeon Kim , Hosaeng Kim , Sumin Yun , Woomin Jang , Myunghun Jeong , Jaehoon Jo
Abstract: In an embodiment, an electronic device may include a housing having an inner space and an antenna structure disposed in the inner space of the housing. The antenna structure may include a printed circuit board (PCB) and at least one antenna disposed in the PCB. The PCB may have a plurality of insulating layers and a ground layer. The at least one antenna may include a conductive line disposed on a first insulating layer among the plurality of insulating layers, a conductive via extended from the conductive line in a first direction, and at least one conductive pattern branched at a right angle from the conductive line on the first insulating layer. The wireless communication circuit may be configured to transmit and/or receive a radio signal in a range of about 3 GHz to about 100 GHz through the at least one antenna.
-
-
-
-
-
-
-
-
-
Search Results
48
records
(took 0.024 seconds)
