公开(公告)号：US08021006B2

公开(公告)日：2011-09-20

申请号：US12331021

申请日：2008-12-09

申请人： San-Woei Shyu ,  Chu-Fong Lam ,  Teng-Chien Yu ,  Yi-Fan Liao

发明人： San-Woei Shyu ,  Chu-Fong Lam ,  Teng-Chien Yu ,  Yi-Fan Liao

IPC分类号： F21V5/04

CPC分类号： G03B15/02

摘要： A LED array flash for cameras includes a LED array and a controller. The LED array consists of at least one LED light source with first order lens. The LED light source may be further covered with a second order lens. Thus an oblong or round distribution pattern with uniform light intensity is emitted. The controller is used to control flash modes such as low brightness continuous lighting or high brightness pulse lighting with lighting time control so as to save power and avoid overheating.

摘要翻译： 用于照相机的LED阵列闪光灯包括LED阵列和控制器。 LED阵列由至少一个具有一阶透镜的LED​​光源组成。 LED光源可以被二阶透镜进一步覆盖。 因此，发射具有均匀光强度的长圆形或圆形分布图案。 控制器用于控制闪光模式，例如低亮度连续照明或高亮度脉冲照明，具有照明时间控制，以节省电力并避免过热。

公开(公告)号：US20100014274A1

公开(公告)日：2010-01-21

申请号：US12331021

申请日：2008-12-09

申请人： San-Woei Shyu ,  Chu-Fong Lam ,  Teng-Chien Yu ,  Yi-Fan Liao

发明人： San-Woei Shyu ,  Chu-Fong Lam ,  Teng-Chien Yu ,  Yi-Fan Liao

IPC分类号： G03B15/02

CPC分类号： G03B15/02

摘要： A LED array flash for cameras includes a LED array and a controller. The LED array consists of at least one LED light source with first order lens. The LED light source may be further covered with a second order lens. Thus an oblong or round distribution pattern with uniform light intensity is emitted. The controller is used to control flash modes such as low brightness continuous lighting or high brightness pulse lighting with lighting time control so as to save power and avoid overheating.

摘要翻译： 用于照相机的LED阵列闪光灯包括LED阵列和控制器。 LED阵列由至少一个具有一阶透镜的LED​​光源组成。 LED光源可以被二阶透镜进一步覆盖。 因此，发射具有均匀光强度的长圆形或圆形分布图案。 控制器用于控制闪光模式，例如低亮度连续照明或高亮度脉冲照明，具有照明时间控制，以节省电力并避免过热。

公开(公告)号：US20090237942A1

公开(公告)日：2009-09-24

申请号：US12284370

申请日：2008-09-22

申请人： Chu-Fong Lam ,  Yi-Fan Liao

发明人： Chu-Fong Lam ,  Yi-Fan Liao

IPC分类号： F21V13/04 ,  F21V5/04

CPC分类号： H01L33/58 ,  Y10S362/80

摘要： A package structure for light emitting diode (LED) comprises a base, an LED die, an optical lens and a lens holder. The base comprises at least one holder cavity formed on its surface and at least one chase formed on its side surface. The lens holder comprises an opening, at least one holder stem and at least one wedge. The optical lens is arranged between the lens holder and the base, and also through the opening. The lens holder is fastened on the base by wedging the wedge with the chase and positioned on the base by embedding the holder stem into the holder cavity to enhance the positioning between the optical lens and the base, such that the optical lens can generate a desired light pattern. Therefore, the required time of a packaging process can be reduced, and the lens holder can be removed simply for replacing the optical lens, so the objective of changing the light pattern quickly can be achieved.

摘要翻译： 用于发光二极管（LED）的封装结构包括基座，LED管芯，光学透镜和透镜保持器。 底座包括在其表面上形成的至少一个保持器腔和在其侧表面上形成的至少一个追逐。 透镜保持器包括开口，至少一个保持器杆和至少一个楔形件。 光学透镜布置在透镜保持器和基座之间，并且还通过开口。 通过将夹持器杆嵌入保持器腔体中以增强光学透镜和基座之间的定位，将镜片夹持器固定在基座上，并通过楔入楔形物定位在基座上，使得光学透镜可以产生期望的 光图案。 因此，可以减少包装处理所需的时间，并且可以简单地移除透镜架以更换光学透镜，因此可以实现快速改变光图案的目的。

公开(公告)号：US07780313B2

公开(公告)日：2010-08-24

申请号：US12284370

申请日：2008-09-22

申请人： Chu-Fong Lam ,  Yi-Fan Liao

发明人： Chu-Fong Lam ,  Yi-Fan Liao

IPC分类号： F21V33/00

CPC分类号： H01L33/58 ,  Y10S362/80

摘要： A package structure for light emitting diode (LED) comprises a base, an LED die, an optical lens and a lens holder. The base comprises at least one holder cavity formed on its surface and at least one chase formed on its side surface. The lens holder comprises an opening, at least one holder stem and at least one wedge. The optical lens is arranged between the lens holder and the base, and also through the opening. The lens holder is fastened on the base by wedging the wedge with the chase and positioned on the base by embedding the holder stem into the holder cavity to enhance the positioning between the optical lens and the base, such that the optical lens can generate a desired light pattern. Therefore, the required time of a packaging process can be reduced, and the lens holder can be removed simply for replacing the optical lens, so the objective of changing the light pattern quickly can be achieved.

摘要翻译： 用于发光二极管（LED）的封装结构包括基座，LED管芯，光学透镜和透镜保持器。 底座包括在其表面上形成的至少一个保持器腔和在其侧表面上形成的至少一个追逐。 透镜保持器包括开口，至少一个保持器杆和至少一个楔形件。 光学透镜布置在透镜保持器和基座之间，并且还通过开口。 通过将夹持器杆嵌入保持器腔体中以增强光学透镜和基座之间的定位，将镜片夹持器固定在基座上，并通过楔入楔形物定位在基座上，使得光学透镜可以产生期望的 光图案。 因此，可以减少包装处理所需的时间，并且可以简单地移除透镜架以更换光学透镜，因此可以实现快速改变光图案的目的。

公开(公告)号：US20070114558A1

公开(公告)日：2007-05-24

申请号：US11284825

申请日：2005-11-23

申请人： Chu-Fong Lam

发明人： Chu-Fong Lam

IPC分类号： H01L33/00

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

摘要： An LED module to realize light source performance as desire is comprised of multiple LEDs, a light-emitting chip of each LED being disposed in a carrier on a substrate; conduction circuits with different polarities being provided perimeter to the carrier on the substrate; golden plate wire connecting the chip and circuits; carrier being filled with fluorescent material before encapsulation; a slope being formed on the inner wall of the carrier; and the light-emitting angles varying depending on inclination carrier or the encapsulating height.

摘要翻译： 实现光源性能的LED模块由多个LED组成，每个LED的发光芯片设置在基板上的载体中; 具有不同极性的导电电路周边设置在衬底上的载体上; 金线连接芯片和电路; 载体在封装前填充荧光材料; 斜面形成在载体的内壁上; 并且发光角度根据倾斜载体或封装高度而变化。

公开(公告)号：US08039849B2

公开(公告)日：2011-10-18

申请号：US11284825

申请日：2005-11-23

申请人： Chu-Fong Lam

发明人： Chu-Fong Lam

IPC分类号： H01L33/60

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

摘要： An LED module to realize light source performance as desire is comprised of multiple LEDs, a light-emitting chip of each LED being disposed in a carrier on a substrate; conduction circuits with different polarities being provided perimeter to the carrier on the substrate; golden plate wire connecting the chip and circuits; carrier being filled with fluorescent material before encapsulation; a slope being formed on the inner wall of the carrier; and the light-emitting angles varying depending on inclination carrier or the encapsulating height.

摘要翻译： 实现光源性能的LED模块由多个LED组成，每个LED的发光芯片设置在基板上的载体中; 具有不同极性的导电电路周边设置在衬底上的载体上; 金线连接芯片和电路; 载体在封装前填充荧光材料; 斜面形成在载体的内壁上; 并且发光角度根据倾斜载体或封装高度而变化。