公开(公告)号：US07834439B2

公开(公告)日：2010-11-16

申请号：US11942552

申请日：2007-11-19

申请人： Sang-Wook Park ,  Seung-Jae Lee ,  Seung-Yeol Yang

发明人： Sang-Wook Park ,  Seung-Jae Lee ,  Seung-Yeol Yang

IPC分类号： H01L23/04

CPC分类号： H05K3/303 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/183 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module preferably includes a semiconductor package and a printed circuit board (PCB). The semiconductor package can include an outer terminal. The PCB can include a terminal land that is electrically connected to the outer terminal. The PCB preferably has a recess configured to at least partially expose the terminal land and to receive the outer terminal. The recess preferably has a width that is less than a width of the semiconductor package. Damage to edge portions of the semiconductor package whose outer terminal is received into the recess may be prevented, because the edge portions make contact with and are supported by the PCB. One or more support members can also be provided to contact one or more sides of the edge portions of the semiconductor package to further prevent damage due to horizontal impacts.

摘要翻译： 半导体模块优选地包括半导体封装和印刷电路板（PCB）。 半导体封装可以包括外部端子。 PCB可以包括电连接到外部端子的端子区域。 PCB优选地具有凹部，其被配置为至少部分地暴露端子台并且接收外部端子。 凹部优选地具有小于半导体封装的宽度的宽度。 由于边缘部分与PCB接触并被PCB支撑，所以可以防止其外部端子被容纳到凹部中的半导体封装的边缘部分的损坏。 还可以提供一个或多个支撑构件以接触半导体封装的边缘部分的一个或多个侧面，以进一步防止由于水平冲击造成的损坏。