摘要:
An image providing apparatus includes: a user location acquisition unit which acquires locations of users; a barrier adjustment unit which adjusts at least one of a space between a display and a barrier screen, a size of a barrier slot, and a left/right movement amount of the barrier slot at least based on a user's location of at least one of the users; an image generation unit which generates an image of which a view point region is adjusted, by the barrier adjustment unit, to the user's location; and an image output unit which outputs the generated image on a display.
摘要:
A video communication method includes: acquiring a plurality of 2D images corresponding to a talker using a 3D camera; adjusting a point of convergence of the plurality of 2D images using a feature point of the talker; detecting an object located between the talker and the 3D camera using the acquired plurality of 2D images; scaling an original sense of depth of the detected object to a new sense of depth; and generating a 3D talker image including the object with the new sense of depth and transmitting the 3D talker image to a 3D video communication apparatus of a listener.
摘要:
A display apparatus is provided, which includes a motion recognition unit which recognizes a motion of an object that is located outside the display device, and a control unit which, when the motion of the object is recognized, determines a change amount that varies according to a motion speed or a motion distance of the object, and performs an operation which corresponds to the motion of the object according to the change amount. Accordingly, channel change or page shift can be easily performed.
摘要:
A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.
摘要:
A method of removing a noise signal from an input signal, the method including receiving a pure noise signal and an input signal including the noise signal; determining whether the pure noise signal is a static noise signal or a non-static noise signal; and removing the noise signal from the input signal according to whether the noise signal is determined to be the static noise signal or the non-static noise signal.
摘要:
A method for removing a noise signal from an input signal that is received. In the method, the amount of energy of the input signal is detected, a noise signal included in the input signal is estimated, an intermediate output signal is generated by removing the estimated noise signal from the input signal, and a final output signal is generated by amplifying the amount of energy of the intermediate output signal based on a difference between the amount of energy of the intermediate output signal and the amount of energy of the input signal.