摘要:
A DRAM includes memory blocks in a form of division of shared sense amplifier configuration in which sub arrays and sense amplifiers serving as cache memories are alternately arranged in the X direction of a memory chip. The memory blocks are arranged in the Y direction. Data lines are formed in parallel with the Y direction for the corresponding sub arrays, for transferring data held in the sense amplifiers corresponding to the sub arrays. I/O pads are arranged in parallel with the X direction, for inputting/outputting data to/from the corresponding sub arrays via the data lines. When the shared sense amplifier configuration and sense amplifier cache system are achieved in a small area of the DRAM, the hit rate of the cache memories is increased, and data can be transferred at high speed by shortening data paths formed in the memory chip.
摘要翻译:DRAM包括以共享读出放大器配置划分的形式的存储器块,其中用作高速缓冲存储器的子阵列和读出放大器在存储器芯片的X方向上交替排列。 存储块沿Y方向排列。 数据线与对应的子阵列的Y方向平行地形成,用于传送保持在与子阵列相对应的读出放大器中的数据。 I / O焊盘与X方向平行布置,用于经由数据线向/从相应的子阵列输入/输出数据。 当在DRAM的小区域中实现共享读出放大器配置和读出放大器缓存系统时,高速缓冲存储器的命中率增加,并且可以通过缩短存储芯片中形成的数据路径来高速传输数据。
摘要:
In a dynamic type memory, a memory cell array is divided into a plurality of sub arrays on a memory chip. Each of the sub arrays is provided with a data line formed in parallel with word lines. Data buffer and multiplexer circuits and I/O pads are arranged on one side of the memory chip in parallel with bit lines. This arrangement allows a data path to be shortened and enables data to be transferred at high speed.
摘要:
A dynamic memory comprises a control circuit for controlling the selection of the row decoder and the activation of the sense amplifiers in accordance with a RAS signal externally supplied thereto and a word line control circuit for controlling a selected word line to turn the electric potentials read out from the memory cells connected to the word line on the bit lines connected to the respective memory cells back to an inactive level after the electric potentials are sensed and amplified by the sense amplifiers corresponding to the respective bit lines during the time period from the time when the RAS signal is turned to an active level and the time when it is turned back to the inactive level. A dynamic memory has gate oxide films are designed to be subjected to a less electric field strength in order to minimize the degradation of reliability and the memory can effectively reduce the fall of the word line driving stepped-up voltage to eliminate the necessity of a leak current compensation circuit. Additionally, the memory reduces the time required to restore the electric potentials for a data reading operation and also the cycle time required for a data writing operation.
摘要:
In a dynamic type memory, a memory cell array is divided into a plurality of sub arrays on a memory chip. Each of the sub arrays is provided with a data line formed in parallel with word lines. Data buffer and multiplexer circuits and I/O pads are arranged on one side of the memory chip in parallel with bit lines. This arrangement allows a data path to be shortened and enables data to be transferred at high speed.
摘要:
A semiconductor memory device includes a silicon chip and sub-arrays formed in the chip. In each of the sub-arrays, memory cells arranged in a matrix form, word lines provided for respective rows of each of the sub-arrays, and bit lines provided for respective columns of each of the sub-arrays are arranged. Further, in the chip, amplifier groups for amplifying data read out from the memory cells are arranged for the respective sub-arrays. Amplifiers connected to respective bit lines are provided in the amplifier groups and the amplifiers each have a function of continuously holding data read out from the memory cell.
摘要:
A semiconductor integrated circuit device includes: a semiconductor substrate, on which diffusion layers are formed; and multilayered wirings stacked above the semiconductor substrate to be connected to the diffusion layers via contact plugs, wherein a first wring and a second wiring formed thereabove are connected to the diffusion layers via first contact plug(s) and second contact plugs, respectively, and the number of the second contact plugs arrayed in parallel is set to be greater than that of the first contact plug(s).
摘要:
Systems and methods for reducing the latency of data transfers between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. In one embodiment, a memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifiers, a second-level sense amplifier and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct data transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) to the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier.) The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic.
摘要:
Systems and methods for reducing the latency of data transfers between memory cells by enabling data to be transferred directly between sense amplifiers in the memory system. In one embodiment, a memory system uses a conventional DRAM memory structure having a pair of first-level sense amplifiers, a second-level sense amplifier and control logic for the sense amplifiers. Each of the sense amplifiers is configured to be selectively coupled to a data line. In a direct data transfer mode, the control logic generates control signals that cause the sense amplifiers to transfer data from a first one of the first-level sense amplifiers (a source sense amplifier) to the second-level sense amplifier, and from there to a second one of the first-level sense amplifiers (a destination sense amplifier.) The structure of these sense amplifiers is conventional, and the operation of the system is enabled by modified control logic.
摘要:
Systems and methods for reducing instability and writability problems arising from relative variations between voltages at which memory cells and logic components that access the memory cells operate by inhibiting memory accesses when the voltages are not within an acceptable operating range. One embodiment comprises a pipelined processor having logic components which receive power at a first voltage and a set of SRAM cells which receive power at a second voltage. A critical condition detector is configured to monitor the first and second voltages and to determine whether the ratio of these voltages is within an acceptable range. When the voltages are not within the acceptable range, an exception is generated, and an exception handler stalls the processor pipeline to inhibit accesses to the SRAM cells. When the voltages return to the acceptable range, the exception handler resumes the pipeline and completes handling of the exception.
摘要:
Systems and methods for determining local voltages provided by a power distribution network to an integrated circuit chip by applying an external voltage to a power distribution network, firing a set of current sources distributed across the chip and measuring local voltages on the chip. The current sources may, for example, comprise a clock tree carrying a free-running clock signal, or multiple individual current source structures. The voltages may be measured, for instance, by units comprising voltage controlled oscillators (VCO's) coupled to counters which determine the corresponding oscillation frequencies and registers which store the resulting oscillation counts. The measured voltages may be used to identify non-uniformities in the voltage applied across the chip, as well as to determine local differences in the resistance of the power distribution network.