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    Stereoscopic image display apparatus
    3.
    发明授权
    Stereoscopic image display apparatus 失效
    立体图像显示装置

    公开(公告)号：US07165841B2

    公开(公告)日：2007-01-23

    申请号：US10761352

    申请日：2004-01-22

    申请人： Hideo Satoh ,  Takashi Chuman ,  Yoshihiko Uchida ,  Atsushi Yoshizawa ,  Takuya Hata

    发明人： Hideo Satoh ,  Takashi Chuman ,  Yoshihiko Uchida ,  Atsushi Yoshizawa ,  Takuya Hata

    IPC分类号： G03B21/00 ,  H04N13/04 ,  G02B27/22

    CPC分类号： H04N13/393 ,  H04N13/395

    摘要： A stereoscopic image display apparatus includes at least two linear image display devices which respectively display linear images in response to image signals. The two linear image display devices are periodically moved by a mechanical scan mechanism along a plurality of locus planes substantially parallel to each other. The mechanical scan mechanism may have a configuration which belt-drives the at least two linear image display devices fixed to a belt, or a configuration which rotationally drives the at least two linear image display devices provided on a disc. The stereoscopic image display apparatus can display a bright and extremely clear stereoscopic image without using a complicated optical system and a light transmissible display panel.

    摘要翻译： 立体图像显示装置包括响应于图像信号分别显示线性图像的至少两个线性图像显示装置。 两个线性图像显示装置通过机械扫描机构沿着彼此基本平行的多个轨迹平面周期性地移动。 机械扫描机构可以具有如下配置：带式驱动固定到皮带的至少两个线性图像显示装置，或旋转地驱动设置在盘上的至少两个线性图像显示装置的构造。 立体图像显示装置可以在不使用复杂的光学系统和可透光显示面板的情况下显示明亮且极其清晰的立体图像。

    SEMICONDUCTOR SUBSTRATE MANUFACTURE APPARATUS, SEMICONDUCTOR SUBSTRATE MANUFACTURE METHOD, AND SEMICONDUCTOR SUBSTRATE
    6.
    发明申请
    SEMICONDUCTOR SUBSTRATE MANUFACTURE APPARATUS, SEMICONDUCTOR SUBSTRATE MANUFACTURE METHOD, AND SEMICONDUCTOR SUBSTRATE 审中-公开
    半导体基板制造设备，半导体基板制造方法和半导体基板

    公开(公告)号：US20100044890A1

    公开(公告)日：2010-02-25

    申请号：US12450229

    申请日：2007-03-22

    申请人： Hideo Ochi ,  Atsushi Yoshizawa ,  Hideo Satoh ,  Tashaki Chuman ,  Satoru Ohta ,  Chihiro Harada

    发明人： Hideo Ochi ,  Atsushi Yoshizawa ,  Hideo Satoh ,  Tashaki Chuman ,  Satoru Ohta ,  Chihiro Harada

    IPC分类号： H01L21/66 ,  G21K5/10 ,  H01L23/544

    CPC分类号： H01L51/0097 ,  H01L21/681 ,  H01L27/1292 ,  H01L51/56 ,  H01L2251/5338 ,  Y02E10/549 ,  Y02P70/521

    摘要： [Problems] To perform predetermined processing such as annealing and coating application of a semiconductor material with high accuracy on a number of semiconductor formation areas formed over a wide region on a surface of a substrate having elasticity such as a plastic substrate even when the substrate expands and contracts.[Solving Means] A semiconductor substrate manufacture apparatus includes: a tracking device (33) having a light-emitting portion (34) which applies light to a substrate surface during tracking, a light-receiving portion (35) which receives the light applied by the light-emitting portion (34) and reflected by the substrate surface, and a position detecting portion (36) which detects the positions of the semiconductor formation areas on the substrate based on the spectrum or intensity of the received light; and a semiconductor processing device for performing the predetermined processing on each of the semiconductor formation areas based on position information from the tracking device (33). For example, an annealing light application device (37) or an inkjet nozzle (41) is used as the semiconductor processing device.

    摘要翻译： [问题]即使当基板膨胀时，也可以在诸如塑料基板的具有弹性的基板的表面上在宽范围上形成的多个半导体形成区域上高精度地退火和涂覆半导体材料的预定处理 和合同。 【解决方案】半导体衬底制造装置包括：跟踪装置（33），其具有在跟踪期间向衬底表面施加光的发光部（34）;受光部（35），其接收由 发光部分（34）并被基板表面反射;以及位置检测部分（36），其基于所接收的光的光谱或强度来检测基板上的半导体形成区域的位置; 以及半导体处理装置，用于基于来自跟踪装置（33）的位置信息对每个半导体形成区域执行预定处理。 例如，使用退火光施加装置（37）或喷墨喷嘴（41）作为半导体处理装置。