SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, POWER CONTROL DEVICE, AND ELECTRONIC EQUIPMENT AND MODULE
    10.
    发明申请
    SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, POWER CONTROL DEVICE, AND ELECTRONIC EQUIPMENT AND MODULE 审中-公开
    半导体器件,半导体器件制造方法,功率控制器件和电子设备和模块

    公开(公告)号:US20090121777A1

    公开(公告)日:2009-05-14

    申请号:US12257502

    申请日:2008-10-24

    申请人: Satoshi NAKAJIMA

    发明人: Satoshi NAKAJIMA

    IPC分类号: H03K17/74

    摘要: A semiconductor device of the invention for miniaturizing and cost reduction includes: a solid-state relay 30 having a first light emitting element 10, a light triggered element 16 for receiving light from the first light emitting element 10, and translucent resin 23 for sealing the first light emitting element 10 and the light triggered element 16; a bidirectional input-type photocoupler 31 having second, third light emitting elements 12, 14 of antiparallel connection, a phototransistor 19 for receiving light from the second, third light emitting elements, and translucent resin 23 for sealing the second, third light emitting elements and the phototransistor 19; and a light shielding wall 25 for light-shielding the solid-state relay 30 and the bidirectional input-type photocoupler 31 from each other. The solid-state relay 30 and the bidirectional input-type photocoupler 31 are integrated into one package in a light-shielded state from each other by the light shielding wall 25.

    摘要翻译: 本发明的用于小型化和成本降低的半导体器件包括:具有第一发光元件10的固态继电器30,用于接收来自第一发光元件10的光的光触发元件16和用于密封第一发光元件10的透光性树脂23。 第一发光元件10和光触发元件16; 具有反并联连接的第二,第三发光元件12,14的双向输入型光电耦合器31,用于接收来自第二,第三发光元件的光的光电晶体管19和用于密封第二,第三发光元件的半透明树脂23和 光电晶体管19; 以及用于对固态继电器30和双向输入型光电耦合器31进行遮光的遮光壁25。 固态继电器30和双向输入型光电耦合器31通过遮光壁25彼此以遮光状态被集成在一个封装中。