MANUFACTURE METHOD FOR ZnO-BASED LIGHT EMITTING DEVICE
    1.
    发明申请
    MANUFACTURE METHOD FOR ZnO-BASED LIGHT EMITTING DEVICE 有权
    基于ZnO的发光器件的制造方法

    公开(公告)号:US20110059563A1

    公开(公告)日:2011-03-10

    申请号:US12874533

    申请日:2010-09-02

    IPC分类号: H01L33/32

    摘要: A manufacture method for a ZnO-based light emitting device, includes the steps of: forming a ZnO-based semiconductor layer of a first conductivity type above a substrate; two-dimensionally growing a first ZnO-based semiconductor layer of a second conductivity type opposite to the first conductivity type above the ZnO-based semiconductor layer of the first conductivity type; and three-dimensionally growing a second ZnO-based semiconductor layer of the second conductivity type on the first ZnO-based semiconductor layer of the second conductivity type.

    摘要翻译: 一种ZnO系发光元件的制造方法,其特征在于,包括以下工序:在基板的上方形成第一导电型的ZnO系半导体层; 在第一导电类型的ZnO基半导体层之上二维生长与第一导电类型相反的第二导电类型的第一ZnO基半导体层; 并且在第二导电类型的第一ZnO基半导体层上三维地生长第二导电类型的第二ZnO基半导体层。

    Manufacture method for ZnO-based light emitting device
    2.
    发明授权
    Manufacture method for ZnO-based light emitting device 有权
    ZnO基发光器件的制造方法

    公开(公告)号:US08227281B2

    公开(公告)日:2012-07-24

    申请号:US12874533

    申请日:2010-09-02

    IPC分类号: H01L21/00 H01L21/16

    摘要: A manufacture method for a ZnO-based light emitting device, includes the steps of: forming a ZnO-based semiconductor layer of a first conductivity type above a substrate; two-dimensionally growing a first ZnO-based semiconductor layer of a second conductivity type opposite to the first conductivity type above the ZnO-based semiconductor layer of the first conductivity type; and three-dimensionally growing a second ZnO-based semiconductor layer of the second conductivity type on the first ZnO-based semiconductor layer of the second conductivity type.

    摘要翻译: 一种ZnO系发光元件的制造方法,其特征在于,包括以下工序:在基板的上方形成第一导电型的ZnO系半导体层; 在第一导电类型的ZnO基半导体层之上二维生长与第一导电类型相反的第二导电类型的第一ZnO基半导体层; 并且在第二导电类型的第一ZnO基半导体层上三维地生长第二导电类型的第二ZnO基半导体层。

    Reflective type semiconductor light emitting device
    9.
    发明授权
    Reflective type semiconductor light emitting device 有权
    反射型半导体发光元件

    公开(公告)号:US07834371B2

    公开(公告)日:2010-11-16

    申请号:US12025044

    申请日:2008-02-03

    IPC分类号: H01L33/00

    摘要: A semiconductor light emitting device manufacture method is provided which can manufacture a semiconductor light emitting device of high quality. A first substrate of an n-type ZnO substrate is prepared. A lamination structure including an optical emission layer made of ZnO based compound semiconductor is formed on the first substrate. A p-side conductive layer is formed on the lamination structure. A first eutectic material layer made of eutectic material is formed on the p-side conductive layer. A second eutectic material layer made of eutectic material is formed on a second substrate. The first and second eutectic material layers are eutectic-bonded to couple the first and second substrates. After the first substrate is optionally thinned, an n-side electrode is formed on a partial surface of the first substrate.

    摘要翻译: 提供一种能够制造高质量的半导体发光器件的半导体发光器件制造方法。 制备n型ZnO衬底的第一衬底。 在第一基板上形成包括由ZnO基化合物半导体构成的发光层的层叠结构。 p层导电层形成在层压结构上。 在p侧导电层上形成由共晶材料制成的第一共晶材料层。 在第二基板上形成由共晶材料制成的第二共晶材料层。 第一和第二共晶材料层共晶接合以耦合第一和第二基板。 在第一衬底任选变薄之后,在第一衬底的部分表面上形成n侧电极。