公开(公告)号：US20060185157A1

公开(公告)日：2006-08-24

申请号：US10549175

申请日：2004-03-18

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H05K3/34 ,  B23P19/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应 的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。

公开(公告)号：US07353596B2

公开(公告)日：2008-04-08

申请号：US10549175

申请日：2004-03-18

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H01R9/00 ,  H05K3/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘合辅助剂，以便将粘合助剂供应的部件安装在板上。 所述部件安装工序包括将所述粘接辅助剂供给到所述多个部件中的第一部件，并且在所述粘接助剂的安装完成之前开始向所述多个部件中的第二部件供给所述粘合辅助剂 代理提供的第一个组件到板上。

公开(公告)号：US07797820B2

公开(公告)日：2010-09-21

申请号：US12073523

申请日：2008-03-06

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H05K3/30

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应 的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。

公开(公告)号：US20080163481A1

公开(公告)日：2008-07-10

申请号：US12073523

申请日：2008-03-06

申请人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

发明人： Satoshi Shida ,  Shinji Kanayama ,  Shunji Onobori ,  Shuichi Hirata ,  Mamoru Nakao ,  Kunio Oe ,  Akira Kugihara ,  Shoriki Narita ,  Yoshitaka Etoh ,  Hiroshi Haji

IPC分类号： H05K3/30 ,  B23P21/00 ,  H05K13/04

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K13/046 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  H01L2924/00 ,  H01L2224/0401

摘要： In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

摘要翻译： 在要安装到板上的多个部件的部件安装过程中，形成在要安装到板上的部件的安装侧表面上的多个凸起电极部分与接合助剂接触，使得 向其提供粘接辅助剂以允许将粘合助剂供应的部件安装在板上，部件安装过程包括：将粘合助剂施加到多个部件中的第一部件，并开始供应 的粘合助剂在第一部件安装到基板上之前，在多个部件中的第二部件上。

公开(公告)号：US07731469B2

公开(公告)日：2010-06-08

申请号：US10537406

申请日：2003-11-28

申请人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

发明人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

IPC分类号： B65H1/00

CPC分类号： H01L21/67144 ,  H01L21/67132

摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

摘要翻译： 根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作 通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。

公开(公告)号：US20060054656A1

公开(公告)日：2006-03-16

申请号：US10537406

申请日：2003-11-28

申请人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

发明人： Shoriki Narita ,  Kanji Hata ,  Shuichi Hirata ,  Satoshi Shida ,  Mamoru Nakao

IPC分类号： B23Q15/00

CPC分类号： H01L21/67144 ,  H01L21/67132

摘要： According to the type of the plate placed in a plate placing device of a component feeder, appropriate holding operation and expanding operation are performed selectively and automatically according to the type of the plate by regulating the lowered position of a plate pressurizing member for the tray feeding plate to securely hold the plate and performing wafer expanding while securely holding the wafer feeding plate by releasing the regulation of the lowered position for the wafer feeding plate.

摘要翻译： 根据放置在部件供给器的板放置装置中的板的类型，通过调节用于托盘进给的板加压构件的下降位置，根据板的类型选择性地和自动地执行适当的保持操作和膨胀操作 通过释放用于晶片馈送板的降低位置的调节，牢固地保持板并执行晶片扩张，同时牢固地保持晶片馈送板。