SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20170069636A1

    公开(公告)日:2017-03-09

    申请号:US15160335

    申请日:2016-05-20

    CPC分类号: H01L27/1157 H01L27/11582

    摘要: A semiconductor device includes a plurality of insulation patterns and a plurality of gates alternately and repeatedly stacked on a substrate, a channel pattern extending through the gates in a first direction substantially perpendicular to a top surface of the substrate, a semiconductor pattern between the channel pattern and the substrate, and a conductive pattern between the channel pattern and the semiconductor pattern. The conductive pattern electrically connects the channel pattern to the semiconductor pattern. The conductive pattern contacts a bottom edge of the channel pattern and an upper surface of the semiconductor pattern.

    摘要翻译: 一种半导体器件包括多个绝缘图案和多个栅极交替重复堆叠在基板上,沟道图案沿基本上垂直于基板顶表面的第一方向延伸穿过栅极,沟道图案 和衬底,以及沟道图案和半导体图案之间的导电图案。 导电图案将沟道图案电连接到半导体图案。 导电图案接触通道图案的底部边缘和半导体图案的上表面。