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公开(公告)号:US10737291B2
公开(公告)日:2020-08-11
申请号:US16059627
申请日:2018-08-09
Applicant: Seagate Technology LLC
Inventor: Daniel Richard Buettner , Andrew David Habermas , Daniel Sullivan , Joseph M. Stephan
IPC: G11B5/60 , B05D3/06 , B33Y10/00 , B33Y80/00 , B29C59/02 , G11B5/31 , G03F7/00 , B05D3/12 , B05D7/00 , B29C35/08
Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).
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公开(公告)号:US11651785B1
公开(公告)日:2023-05-16
申请号:US17728661
申请日:2022-04-25
Applicant: Seagate Technology LLC
Inventor: Joseph M. Stephan , Robert Aaron Newman , Lars H. Ahlen , Aaron Michael Collins
CPC classification number: G11B5/6082 , G11B5/3163 , G11B5/1278
Abstract: Methods are described for forming a mounting surface on a slider body. In one method, an adhesion layer can be deposited on a top surface of a slider body. A first photolithography cycle deposits a first metal layer having a first thickness of at least 8 μm. A second photolithography cycle deposits a second metal layer having a second thickness of at least 8 μm over the first metal layer. The first and second layer form a mounting support on the top surface. In another method, the top surface is etched to form a mounting support.
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公开(公告)号:US11355144B1
公开(公告)日:2022-06-07
申请号:US17317277
申请日:2021-05-11
Applicant: Seagate Technology LLC
Inventor: Joseph M. Stephan , Robert Aaron Newman , Lars H. Ahlen , Aaron Michael Collins
Abstract: A slider includes a slider body with an air-bearing surface and a top surface opposing the air-bearing surface. A plurality of slider bond pads are disposed on or parallel to the top surface and proximate to or at a trailing edge of the slider. The plurality of slider bond pads have an exposed surface facing away from the top surface of the slider body. One or more mounting supports extend from the top surface to a distance of at least 12 μm above the exposed surface of the plurality of slider bond pads.
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公开(公告)号:US20180361427A1
公开(公告)日:2018-12-20
申请号:US16059627
申请日:2018-08-09
Applicant: Seagate Technology LLC
Inventor: Daniel Richard Buettner , Andrew David Habermas , Daniel Sullivan , Joseph M. Stephan
CPC classification number: B05D3/067 , B05D3/12 , B05D7/54 , B29C59/02 , B29C59/026 , B29C2035/0827 , B29C2059/023 , B33Y10/00 , B33Y80/00 , G03F7/0002 , G11B5/3106 , G11B5/3163 , G11B5/6005 , G11B5/6082 , Y10T29/49041
Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).
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公开(公告)号:US10058890B1
公开(公告)日:2018-08-28
申请号:US15354718
申请日:2016-11-17
Applicant: Seagate Technology LLC
Inventor: Daniel Richard Buettner , Andrew David Habermas , Daniel Sullivan , Joseph M. Stephan
CPC classification number: B05D3/067 , B05D3/12 , B05D7/54 , B29C59/02 , B29C59/026 , B29C2035/0827 , B29C2059/023 , B33Y10/00 , B33Y80/00 , G03F7/0002 , G11B5/3106 , G11B5/3163 , G11B5/6005 , G11B5/6082 , Y10T29/49041
Abstract: The present disclosure includes methods of forming air bearing surfaces having multi-tier structures using nanoimprint technology and/or 3D printing technology. In some embodiments, a single stage of milling can be used to transfer a multi-tier photoresist pattern into a substrate (e.g., an AlTiC substrate).
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