公开(公告)号：US20210120667A1

公开(公告)日：2021-04-22

申请号：US17113614

申请日：2020-12-07

Applicant: Seagate Technology LLC

Inventor： Michael Richard Fabry ,  William Bradford Green

IPC: H05K1/02 ,  G01R31/28 ,  H05K3/24 ,  H05K1/11

Abstract: A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of thee printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

公开(公告)号：US20200383203A1

公开(公告)日：2020-12-03

申请号：US16424270

申请日：2019-05-28

Applicant: Seagate Technology LLC

Inventor： Michael Richard Fabry ,  William Bradford Green

IPC: H05K1/02 ,  G01R31/28 ,  H05K1/11 ,  H05K3/24

Abstract: A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

公开(公告)号：US10893605B2

公开(公告)日：2021-01-12

申请号：US16424270

申请日：2019-05-28

Applicant: Seagate Technology LLC

Inventor： Michael Richard Fabry ,  William Bradford Green

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/02 ,  H05K7/06 ,  G01R1/067 ,  G01R1/073 ,  G01R31/00 ,  G01R31/02 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/02 ,  H01L21/44 ,  H01L21/60 ,  H01L21/66 ,  H01L21/70 ,  H01L21/82 ,  H01L23/00 ,  H01L23/48 ,  H01L23/58 ,  H01L23/544 ,  H05K3/24

Abstract: A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.